Smarana Mitra
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- Feb 22, 2019
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A chip is just a couple square centimetre in size and is packaged well. It has very little effect of G-forces. The real problem is in temperature for chipsets. The problem of G-forces is applicable for mechanical parts and can be rectified by repeated tests. It is just a matter of making the joints strong and slightly increasing weight to increase sturdiness to reduce shocks from G-Forces. But the main point here is semiconductor guidance. Off the shelf semiconductors can't be used in supersonic missiles simply because the heat generated by fast burning of fuel as well as heat from friction with air destroys the commercial chipsets.Mate, release your frustration on the somewhat slow pace of Indian missile development somewhere else... this is the main Iranian sticky thread on missiles.
At least when you would have argued with g-forces that occur instead of the temperature argument...
Who is showing frustration here? India started semiconductor development in 1980s and India has been able to make accurate missiles by late 1990s. This is 2020. I am speaking strictly of Iranian missiles development and its relation with semiconductor technology. Iran can't make accurate missile until it develops semiconductor.