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Opinionated - China Chipping Away to Semiconductor Dominance

Making a lithography machine is one thing. What about quality and yield of chinese machines ? any idea ?
That is one issue that is almost impossible to quantify at this stage, that depend in whole range of factors from how many wafers the can process per time to how good is the fab process node. But in my opinion even if is not as good as ASML at the beginning they can still use the machine to make advance chips for the military, government and companies with export control issues until China lithography abilities are perfected, working with Huawei and SMIC can give SMEE an enormous experience in a short time. Like ASML gain with TSMC.
 
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China to push for foundry process advancements | Digitimes
Eric Chen, DIGITIMES Research, Taipei
Tuesday 11 August 2020

China with its 14th Five-year Plan (2021-2025) will assist its domestic foundries in the development of advanced 7nm and FD-SOI fabrication process technologies, according to Digitimes Research.

China continues to proceed with its semiconductor self-sufficiency strategy, with plans to also help its domestic foundries further expand their existing production capacities during the five-year period.

uring China's 13th Five-year Plan, the country's foundry sector has advanced its manufacturing process technology to 14nm and will be capable of fabricating chips using a newer 12nm process technology this year. The transition to more-advanced 7nm process, as well as specialty technology namely FD-SOI, will be the next target during China's next five-year plan.

SMIC, China's most advanced and largest foundry, will be developing its 7nm, sub-7nm and EUV-based process technologies over the next five years, in line with the goal set forth by China's 14th Five-year Plan, Digitimes Research believes.
 
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Xiaomi Not Abandoning Surge Chipsets, To Invest Over 10 bln yuan in R&D in 2020 - Pandaily
Isabel Wang
Posted on August 13, 2020

Xiaomi-Smartphone-Chipsets-1600x832.png
(Source: Xiaomi)

Xiaomi‘s founder and CEO Lei Jun confirmed Tuesday evening that the company has not given up on its self-developed Surge chipsets, despite the lack of any follow-up model since the company launched its first processor Surge S1 in 2017.

“It is true that we came across some difficulties since we launched the Surge S1 in 2017,” Lei said on his official Weibo account after being asked whether Xiaomi will continue developing the chipset. “But we have not given up the plan. I will keep the public updated when we make actual progress.”

Lei then confirmed this during his speech on Tuesday for the company’s 10th anniversary event.

China’s smartphone maker introduced its first in-house chipset Surge S1 in February 2017, intended to power its flagship Mi 5C smartphone and making Xiaomi one of the few manufacturers in the world to have a proprietary smartphone chip — joining Huawei, Apple, and Samsung. However, Mi 5C remains the only smartphone to be powered by this Surge S1 SoC years after its launch.

According to Lei, Xiaomi’s research and development (R&D) expenditure in 2020 is expected to surpass 10 billion yuan.

“Our ceaseless motivation to extensively explore and innovate, combined with our R&D investments have enabled us to bring more and cooler projects to the customers,” Lei said.

SEE ALSO: Xiaomi Launches New Lifestyle Products

Lei also highlighted three major development strategies for the company during his speech, including rebuilding the passion for innovation, using the Internet to empower manufacturing, and pursuing a sound and steady strategic development.

“We believe in the power of the Internet and its approaches. We will continue to empower manufacturing with the Internet,” Lei said. “We will also evaluate things in view of 10 years, and do things that will be valuable in the long-term.”
 
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What a shame, china with the worlds most number of human beings still cant produce fab tech invented in 1976.

Would it be racism to say that chinese are not good enough to innovate?
 
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What a shame, china with the worlds most number of human beings still cant produce fab tech invented in 1976.

Would it be racism to say that chinese are not good enough to innovate?
Chinese are not Indians mate. Chinese never invented warp drive and airplanes in 10,000 BC. I heard India has manufactured a 1 nm lithography machine
 
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Chinese are not Indians mate. Chinese never invented warp drive and airplanes in 10,000 BC. I heard India has manufactured a 1 nm lithography machine

All I know is the best cginese ever dod was invent awesome fireworks and steal IP.

Hard to beat.
 
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All I know is the best cginese ever dod was invent awesome fireworks and steal IP.

Hard to beat.
Besides claiming to invent the internet, is there anything India has actually done for the world? Slums and open defecation do not count I'm afraid.
What a shame, china with the worlds most number of human beings still cant produce fab tech invented in 1976.

Would it be racism to say that chinese are not good enough to innovate?
And India can :lol::lol::lol::lol::lol::lol::lol:
 
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Yangtze Memory's 128-layer QLC flash memory debuts with highest I/O speed
2020-08-14 23:48:14 GMT+8 | cnTechPost

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After announcing the successful development of 128-layer QLC 3D flash memory on April 13 this year, Yangtze Memory Technologies, China's top memory chipmaker under the umbrella of Tsinghua Unigroup, publicly demonstrated its 128-layer QLC 3D NAND flash memory chip at the China Electronic Information Expo held today.

Yangtze Memory showcased a 64-layer, a 128-layer stack of flash memory this time, of which the former is the first 64-layer flash memory developed and mass-produced by a Chinese company. It is based on the Xtacking stacking architecture, and the storage density per unit area is the largest in its class.

At present, the main product of Yangtze Memory's mass production is 64-layer TLC flash memory, which has been adopted by a large number of manufacturers' SSD hard drives.

The 128-layer QLC flash memory shown by Yangtze Memory is the next generation product after 64-layer flash memory, based on the Xtacking 2.0 architecture.

According to the company, the uniqueness of this product is that it is the industry's first 128-layer QLC 3D NAND. It has the highest storage density per unit area, the highest I/O transmission speed and the highest single NAND flash memory chip capacity among known models.

In terms of performance, Yangtze Memory revealed that the two products have 1.6Gbps I/O read and write performance, and the single 3D QLC capacity is as high as 1.33Tb, which is 5.33 times that of the previous generation of 64 layers.
 
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Sinyang Semiconductor to Privately Woo USD216 Million for Two IC Chemical Projects
TANG SHIHUA
DATE: AN HOUR AGO / SOURCE: YICAI

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Sinyang Semiconductor to Privately Woo USD216 Million for Two IC Chemical Projects

(Yicai Global) Aug. 17 -- Shanghai Sinyang Semiconductor Materials will raise CNY1.5 billion (USD216 million) from qualified institutional investors to produce high-end photoresist products for integrated circuits and ultra-high-purity chemical materials.

The firm will apply CNY732 million (USD105.3 million) of the proceeds to develop and industrialize high-end photoresist products for integrated circuits, CNY348 million to hike its capacity to produce semi-conductor related ultra-high-purity chemical materials, and CNY420 million to supplement its working capital, the company announced over the weekend.

Sinyang Semiconductor’s stock [SHE:300236] rose 3.85 percent to close at CNY63.61 (USD9.16) at lunch today.

The firm’s Shanghai base will produce the photoresist products, consisting of ArF and KrF photoresist products, per the announcement. KrF thick-film photoresist products are likely to be sold in small numbers next year and mass produced in 2022. ArF dry process photoresist products are expected to sell in small lots in 2022 and be mass produced in 2023, but the announcement omitted details.

Photoresist is a key raw material for making chips. Almost all major technologies and patents of high-end photoresists represented by ArF and KrF products are in the hands of Japanese and US companies and research agencies, and China has to import all ArF photoresist products it uses to make high-end semiconductor chips, of which more than 90 percent are made in Japan, per the announcement.

The firm will also use the money to build its second factory in East China’s Hefei for CNY350 million. This plant, whose construction period is two years, will add 17,000 tons of ultra-high-purity chemical material capacity.
 
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Sinyang Semiconductor to Privately Woo USD216 Million for Two IC Chemical Projects
TANG SHIHUA
DATE: AN HOUR AGO / SOURCE: YICAI

7275846290636800.jpg

Sinyang Semiconductor to Privately Woo USD216 Million for Two IC Chemical Projects

(Yicai Global) Aug. 17 -- Shanghai Sinyang Semiconductor Materials will raise CNY1.5 billion (USD216 million) from qualified institutional investors to produce high-end photoresist products for integrated circuits and ultra-high-purity chemical materials.

The firm will apply CNY732 million (USD105.3 million) of the proceeds to develop and industrialize high-end photoresist products for integrated circuits, CNY348 million to hike its capacity to produce semi-conductor related ultra-high-purity chemical materials, and CNY420 million to supplement its working capital, the company announced over the weekend.

Sinyang Semiconductor’s stock [SHE:300236] rose 3.85 percent to close at CNY63.61 (USD9.16) at lunch today.

The firm’s Shanghai base will produce the photoresist products, consisting of ArF and KrF photoresist products, per the announcement. KrF thick-film photoresist products are likely to be sold in small numbers next year and mass produced in 2022. ArF dry process photoresist products are expected to sell in small lots in 2022 and be mass produced in 2023, but the announcement omitted details.

Photoresist is a key raw material for making chips. Almost all major technologies and patents of high-end photoresists represented by ArF and KrF products are in the hands of Japanese and US companies and research agencies, and China has to import all ArF photoresist products it uses to make high-end semiconductor chips, of which more than 90 percent are made in Japan, per the announcement.

The firm will also use the money to build its second factory in East China’s Hefei for CNY350 million. This plant, whose construction period is two years, will add 17,000 tons of ultra-high-purity chemical material capacity.
This technology is backward. There's no immersion ArF photoresists, let alone EUV photoresists.
 
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Does anybody know what happened to Fujian Jinhua after the US ban?
 
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Does anybody know what happened to Fujian Jinhua after the US ban?
It got shut down or had its assets to be sold off? Honestly without American technologies, these smaller companies are basically hapless. Even all the doors are closed on Huawei now ... I wonder how they are going to survive this, even with Chinese gov backstopping.
 
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