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Opinionated - China Chipping Away to Semiconductor Dominance

【存储器】国产化SSD真的来了

来源:嘉合劲威 2018-04-28

嘉合劲威集团携手国科微电子推出第一款国产化最高的固态硬盘,光威“弈”系列SSD终于如期而至。光威“弈”系列SSD,从主控芯片、产品品牌到生产制造均由中国企业完成。从产品命名到风格定位再到包装设计也均为中国元素。存储产品高度国产化,它的意义和影响都非常重大。

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国产主控

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国科微是国家规划布局内的重点集成电路设计企业和首家获得国家集成电路产业投资基金注资的集成电路设计企业,也是中南地区规模最大的集成电路设计企业之一。在2017年下半年国科微发布了拥有自主知识产权的第二代存储产品主控GK2301,迅速进入了产品应用阶段。GK2301主控是国内首款获得国测,国密双重认证的主控。

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中国制造

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嘉合劲威是国内高端存储芯片测试企业,拥有记忆体模组厂并设立记忆体产品实验室。2017年自主研发了FLASH、DRAM芯片测试系统。今年再次推出了“存储成品自动测试化方案”,彻底解决了存储产业自动化生产两个最大的难题,2018年实现了中国存储产品制造的智能化升级。

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国产品牌

光威“弈”系列SSD的做工非常精良,采用了国科微的主控GK2301,由嘉合劲威集团深圳工厂倾心打造。

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国科微、嘉合劲威选择光威,既是因为光威品牌在国内有着良好的口碑与影响,也是希望帮助中国存储品牌落地,推动国产SSD品牌的崛起。国产SSD品牌的逐渐成长,未来将为国内消费者带来更多的实惠。

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光威-弈系列SSD,由嘉合劲威与国科微联合出品,无论在技术上还是市场端都给予了高度的支持。只有这样的协作才能让中国制造道路越走越宽。

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在过去,国外品牌的SSD充斥市场,价格昂贵。而由于国产SSD因为主控和FLASH均来自国外,国产SSD无法形成有力的竞争。因此国内相关企业和消费者迫切的希望主控、芯片以及高度国产SSD的到来,国产存储乃国之重器。

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@Bussard Ramjet :coffee::D

Where are they getting their Flash Memory from?
Also, in the english translation, as far as I can understand, they have made no claims on the actual memory. It seems this product is just made by a company who has done the system integration part, not the core memory itself.
I don't know how much market share this will take away, let's see. Only market share can give a picture on how competitive this SSD is.


What does this mean? It is not even a text, that can be translated. An english summary please.
 
China steps up in semiconductor race

By Campos Santiago Source:Global Times Published: 2018/5/7 21:58:39

$47.4b fund aims to reduce import reliance: experts

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A chip developed by Chinese firm Hongqin Technology Co is displayed at an exhibition in Beijing on Monday. Photo: VCG

China will soon launch a new investment fund for its semiconductor industry, aiming to raise up to 300 billion yuan ($47.4 billion), according to industry insiders quoted by the Wall Street Journal.

The fund is drawing worldwide attention as it is seen as instrumental in China's plans to develop its chip industry and solve its over-reliance on foreign suppliers.

This new fund run by the National Integrated Circuitry Industry Investment Fund Co is China's second investment fund aimed at boosting the country's semiconductor industry. The first fund, established by the Ministry of Industry and Information Technology in September 2014, has already attracted investment from government agencies and large corporations in China.

The Wall Street Journal reported on Friday, citing people familiar with the matter, that the new investment fund would aim for more than double the amount of capital raised in the first fund, which began in 2014.

According to figures released by the ministry on April 25, the first fund had by the end of 2017 committed investments worth 118.8 billion yuan in dozens of companies in the Chinese semiconductor industry.

However, some analysts are skeptical. "It depends, really," Liu Kun, vice general manager of the IC Industry Research Center at CCID Consulting, told the Global Times on Monday.

"The fund is actually a rather open investment fund, and it is trying to make a profit on its investments, so the amount it raises depends on the state of the industry," he said.

Liu further noted that the new investment fund is expected to expand its range of investments, likely moving upstream in the industrial chain to promote the growth of semiconductor design companies. The direction of the fund will also influence the amount of capital raised, he said.

"The first investment fund focused quite heavily on chip producers, but this second one will likely look to invest more in design companies," Liu said, adding that 300 billion yuan "sounds high" for only chip-design firms, which does not require high capital, but reasonable for capital-intensive manufacturing firms.

The new fund was announced officially by the Ministry of Industry and Information Technology on April 25. The announcement gave no details on the amount to be raised, but it mentioned that the semiconductor industry in China has been growing 21 percent annually, five times faster than the world's average growth rate for the industry.

The announcement of the new investment fund comes at a delicate time in the chip industry after the US Department of Commerce slapped a seven-year export ban on China's telecommunications equipment provider ZTE.

The sudden US government ban triggered widespread calls in China for cultivating the domestic chip industry and avoiding reliance on foreign chips. China imported $260 billion worth of chips in 2017, according to data from the General Administration of Customs.

Experts said that increasing self-reliance will be a long-term process. "Investment is useful but to create world-class chips requires more than investment. In the short term, Chinese companies probably won't yet achieve parity with US or South Korean companies," said Liu.

Many Chinese companies are also focusing research on innovative products such as artificial intelligence chips.

"China should try to have a two-pronged strategy, developing traditional chips and also trying to achieve an advantage in innovative products such as AI," said Liu.

@qwerrty
 
dealstreetasia.com
Intel Capital announces investments in three Chinese technology startups
Mars Woo
4-5 minutes


Intel Capital, the global investment arm of Silicon Valley-headquartered Intel Corporation, has invested in three Chinese technology startups as part of its 12 new technology investments totalling $72 million.

During the Intel Capital Global Summit in California, the firm said it has invested in Chinese tech startups Reconova, Alauda, and Espressif Systems. The amount that the firm invested in each startup, however, was not disclosed.

Reconova is a Xiamen-based AI company that provides visual perception solutions. The firm is dedicated to the research of innovative computer vision and machine learning technologies.

Beijing-based Alauda is a container-based cloud services startup that provides enterprise IT with the platform-as-a-service offering and other strategic services.

Espressif Systems, based in Shanghai, is a multinational, fabless semiconductor company that leverages wireless computing to create IoT solutions that Intel Capital said are “more intelligent, versatile, and cost-effective”.

Intel Capital also backed the $15-million Series B fundraising of Fictiv, a San Francisco-based software startup that links hardware developers with parts manufacturers in China.

Fictiv, which recently unveiled offfices in Guangzhou, China, said its Series B round was led by Chinese VC firm Sinovation Ventures, with participation from Accel, Intel Capital, Bill Gates, FJ Labs, Tandon Group, and the Stanford-StartX Fund.

The new capital, which brings Fictiv’s fundraising total to $25 million, will be used to broaden the company’s network of more than 200 parts manufacturers, and to introduce new digital tools geared towards automating and optimizing workflows for hardware teams and manufacturers.

Intel Capital said the companies joining its portfolio are driving innovations “that will shape the future of computing over the next decade”.

These startups include AI-based conversational computing to speed the design of virtual assistants; a context-aware app improving the way people experience stadiums, theme parks, hotels and hospitals; and new processors that bring the power of machine learning to mobile devices.

“They’re helping shape the future of artificial intelligence, the future of the cloud and the Internet of Things, and the future of silicon. These are critical areas of technology as the world becomes increasingly connected and smart,” said Wendell Brooks, Intel senior vice president and president of Intel Capital.

With the new $72-million funding, the firm said its investments have already reached more than $115 million so far this year.

Since 1991, Intel Capital has invested US$12.3 billion in over 1,530 companies worldwide, and more than 660 portfolio companies have gone public or been acquired.

Brooks said the latest group of investments reflects Intel Capital’s strategy to make larger investments in new portfolio companies.

“Whether through access to Intel technology, introductions to our worldwide partners or added engineering resources, we’re focused on driving new levels of success for our entrepreneurs,” he said.

Intel Capital has been actively investing in Chinese technology companies. Last year, it backed a Series A+ round in Chinese computer chips maker Horizon Robotics.

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stuff that alibaba plans to do with c-sky, the chip company that they just purchased :D

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Where are they getting their Flash Memory from?
Also, in the english translation, as far as I can understand, they have made no claims on the actual memory. It seems this product is just made by a company who has done the system integration part, not the core memory itself.
I don't know how much market share this will take away, let's see. Only market share can give a picture on how competitive this SSD is.



What does this mean? It is not even a text, that can be translated. An english summary please.
Flash Memory from YMTC (unigroup)
 
china.org.cn
Chinese researchers create core material for homegrown chips
17 hours ago

李慧如
3-4 minutes

Chinese researchers have mastered the technology to create a phenolic resin for photoresist formulations, a material crucial to chip production, and have made it available in the previously monopolized market , the Science and Technology Daily reports.

Tang Yilin, president of Jinan Shengquan Group, the parent company of Asia's largest phenolic resin producing base, said it took his research and development team 26 years to come up with the new material, which is expected to greatly boost domestic chip production.

The producer is now receiving orders from photoresist manufacturers and suppliers.

Li Zhifang, director of the Shengquan Research Institute of Phenolic Resins and a participant in development of the high-end material, said, "We never expected the market of resins for electronic materials, which are mostly used in printed circuit boards (PCBs), could be so substantial."

"However, as the ZTE issue caused widespread concern over China's heavy reliance on chip imports, people called for promotion of home-made chips and we felt it imperative to produce our own high-end synthesized resins for the electronics field," said Li.

As early as 1992, Tang Yilin founded a research group in the hope that they could make their own phenolic resins. However, owing to outdated equipment and insufficient technological support, their first several attempts failed. It was not until 1997, when the group teamed up with Hepworth Mineral and Chemical Co. Ltd. of the U.K., that the cutting-edge technology was introduced.

However, Tang has never forgotten the importance of independent research and development.

"Without a core technology in hand, the company's development will be at the mercy of others, and one could never expect to attain the technology by appealing to others' sympathies," said Tang.

Tang stressed, "We should rely on our own efforts."

Apart from introducing advanced international technologies, the company has exerted great efforts in talent grooming and technological capability building, and established intensive cooperation ties with many research institutes and universities at home. In 2007, the company and the Institute of Chemistry of the Chinese Academy of Sciences jointly established the Research Center of Phenolic Resin Technology and undertook a number of projects, including development of ablation-resistant materials for rockets.

The materials developed by the company have been widely used in building of high-speed railways, maglev trains and the Shenzhou spacecraft series.

China does not lack either technological potential or relevant materials for development of chips. Enterprises on the industrial chain should strengthen solidarity and perseverance so as to go further in technological innovation , Tang said.
 
gtranslate:
Code:
http://news.sgst.cn/zxy/yfzx/201805/t20180509_684290.html
Two domestic high-end radio frequency chips come out, will promote China's 5G layout
20:09, 14:14, 14:14

Astar (Shanghai) High-frequency Communication Technology Co., Ltd. released two radio frequency transceiver system ICs yesterday. The company was independently developed by the company's chairman, Dr. Huang Fengyi, a special expert from Shanghai's "Thousand People Project." After the technical appraisal of the expert group, it has reached the international advanced level. These two chips can be widely used in the fifth-generation mobile communications (5G), ultra-high-speed wireless Internet of things and other areas, and promote China's 5G layout.

Radio frequency chip is a key component of wireless communication and can realize signal transmission, wireless transmission and reception. In the past, usually one frequency band (or including adjacent frequency bands) corresponds to one chip unit, and multiple frequency bands require multiple chip units. With the increase of frequency bands (also called channels) and modes of mobile communications, and increasing bandwidth, today's radio frequency chips need to support more than a dozen channels and meet the performance requirements such as high bandwidth and strong anti-interference ability, so the design is very difficult. At present, most high-end RF chips are monopolized by large international companies. The US Department of Commerce sanctioned ZTE’s ban on sales of high-end RF chips.

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Two chips released by Astertek

In 2001, Huang Fengyi, who was an engineer at the IBM Research and Development Center and served as the Silicon Silicon Technology Project Team, returned to the motherland and founded the Aisite Company in Shanghai's Zhangjiang Hi-Tech Park. He independently developed radio frequency microwave integrated circuit chips, hoping to break the monopoly of foreign technologies and realize The relevant chip is autonomous and controllable.

The high-bandwidth transceiver system chips and the multi-band, multi-mode, reconfigurable transceiver system chips released yesterday were developed over five years. Huang Fengyi told the Liberation Daily·Changguan News reporter that the R&D team had spent many rounds of design and tape-out processing, invested a lot of resources, and finally mastered the key key technologies so that the products could be used in the coming 5G era. In April this year, an expert group consisting of experts from Peking University, the Chinese Academy of Sciences, and China Electronics Technology Group Corporation identified that "the results have reached the international advanced level." After testing, the 19 comprehensive performance indicators of the high-bandwidth transceiver system are compared with the results published by foreign products and documents. Seven key indicators are better than the best reported in the world, and seven key indicators have reached the international level. 5 The indicators are close to world-class standards.

The two chips have obtained 2 national invention patents and applied for 1 PCT international invention patent. In the future, they can be widely used in 5G mobile phones, base stations, ultra-high-speed wireless Internet of things, radio frequency sensors, satellite communications, navigation, and specialized high-bandwidth communications. , radar and other equipment and fields.

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Huang Fengyi introduced a high-bandwidth transceiver system chip. Photo by Wu Jiani

According to reports, the high-bandwidth transceiver system chip integrates the main components of the entire transceiver front-end, featuring high bandwidth, ultra-high speed, and strong anti-interference ability. Its transmission bandwidth is up to 150 megabytes, which is more than 3 times the bandwidth of 4G mobile phones. It can meet the requirements of ultra-high speed and large bandwidth of 5G communications. At present, the United States ADI company already has the same type of chip products. Huang Fengyi said that the chips released this time are superior to ADI products in terms of anti-jamming performance. "The case of crosstalk sometimes occurs on the phone because it is interfered with by other signals. This chip can be applied to secure communication with strong anti-jamming capability."
In the process of design and development, in order to improve the performance and accuracy of the chip, a high-precision RF component model is essential. It is understood that model technology is the basis of chip design, involving some high-end, special technology, and foreign companies sometimes do not provide the most accurate model. After more than ten years of research and exploration, Astortec's R&D team has discovered a new channel effect in the RF model structure of deep submicron and ultra-high-speed transistors, which has broken through the core trench in the model structure used by international industry for more than 30 years. Road unit. Related technologies can be applied to the design manual of the process manufacturers.

Next, Ai Sike will use advanced processing technology, commissioned by SMIC, TSMC and other companies to manufacture chips, so that domestic high-end RF chip plays an important role in the era of 5G, to crack the situation of this kind of chip in China is "card neck" situation. (Author: Yu Ran MILITARY)

.
 
Chinese scientists develop a photonic quantum chip for boosting analog quantum computing

(Xinhua) 10:20, May 12, 2018

WASHINGTON, May 11, (Xinhua) -- Chinese scientists demonstrated the first two-dimensional quantum walks of single photons in real spatial space, which may provide a powerful platform to boost analog quantum computing.

They reported in a paper published on Friday in the journal Science Advances a three-dimensional photonic chip with a scale up to 49-multiply-49 nodes, by using a technique called femtosecond direct writing.

Jin Xianmin, a quantum communication researcher with Shanghai Jiaotong University, who led the study, told Xinhua, it is the largest-scaled chip reported so far that allows for the realization of this two-dimensional quantum walk in real spatial space, and potential exploration for many new quantum computing tasks.

Jin and his colleague showed that the dimension and scale of quantum system could be employed as new resources for boosting the quantum computing power.

The researchers said, universal quantum computers came under the spotlight since last year, as IBM, Google, Intel and the rivals constantly competed to announce their new records on the achieved number of qubits.

However, universal quantum computers are far from being feasible before error correction and full connections between the increasing numbers of qubits could be realized.

In contrast, analog quantum computers, or quantum simulators, can be built in a straightforward way to solve practical problems directly without error correction, and potentially be able to beat the computational power of classical computers in the near future.

Quantum walk in a two-dimensional array is a strikingly powerful and straightforward approach to analog quantum computing. It maps certain computing tasks into the coupling matrix of the quantum paths, and provides efficient solutions to those even classically intractable problems.

Prominent quantum advantages will be promptly achievable as long as the scale of quantum systems goes above a considerably large level.

During the past two decades, a traditional and challenging method has been through increasing the photon number, which suffers from probabilistic generation of single photons and multiplicative loss, according to the researchers.

This ingenuous alternative way from increasing the external physics dimension and complexity of the quantum evolution system may accelerate future analog quantum computing, said Jin.
 
SMIC to start risk production of 14nm FinFET process in 1H19
Cindy Yu, Taipei; Willis Ke, DIGITIMES
Friday 11 May 2018

Semiconductor Manufacturing International Corp (SMIC), the largest China-based foundry house, will kick off risk production of its 14nm FinFET process and venture into the AI (artificial intelligence) chip sector in the first half of 2019 after entering volume production of 28nm HKC+ process in the second half 2018, according to the firm's co-CEO Liang Mong-song.

Liang said at a recent investor conference that SMIC will see an upper single-digit shipment ratio for 28nm process for the whole 2018, with the volume production of its 28nm HKC process to run close to that of its 28nm Poly-SiON process.

In terms of mature process platforms, Liang highlighted the performance upgrades of power management IC process platform, saying that capacities at all its 8-inch wafer fabs are running tight to meet ever-increasing demand for power management ICs including IGBT devices. He added that the high-voltage BCD (bipolar CMOS DMOS) process will be shifted to 12-inch fabs.

Liang also stressed that SMIC will step up its technological developments, aiming to build a comprehensive process platform integrating technologies, IP and design services. In particular, he disclosed, SMIC will move to develop complete AI-based ASIC IPs in the first half of 2019 to provide customers with total IC design solutions.

Sequential 7-9% revenue growth for 2Q18


On the same occasion, another co-CEO Zhao Haijun said SMIC posted better-than-expected revenue performances, continuous growth in market demand and increased capacity utilization in the first quarter of 2018.

Zhao said SMIC raked in revenues of US$831 million for the quarter, including revenues from photomask production, wafer test and other technology royalty incomes. The quarter's gross profits reached US$220.2 million for a margin rate of 26.5%. The company expected a sequential 7-9% revenue growth for the second quarter of 2018, with gross margin to be in the range of 23-25%.

SMIC has expanded the capacity at its 8-inch fab in Shenzhen to 447,750 wafers in the first quarter of 2018 from 442,750 of a quarter earlier, and the average capacity utilization rate has risen to 88.3%.

SMIC posted R&D expenses and capital expenses at US$123 million and US$322 million, respectively, for the first quarter of 2018.

Zhao also disclosed that SMIC now sees 40% of its revenues from the China market, and is in a good position to benefit from the growing popularity of consumer electronics and IoT devices.

In particular, he stressed, SMIC has led in providing foundry services for makers of power management ICs and image sensing devices, and will enjoy a 30% growth in the NOR/NAND flash foundry business in 2018.



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another unicorn :D

chinamoneynetwork.com
Chinese AI Firm Unisound Raises $100M Series C Round Led By China Electronics Health Fund – China Money Network
2-3 minutes


UniHome is one of Unisound's solutions that enable home appliances to be "smart". For example, Unisound powers the voice command functions for refrigerators produced by some Chinese brands.

Chinese artificial intelligence (AI) solution provider Unisound announced that it has raised a US$100 million series C round led by China Electronics Health Fund, a fund established by China Electronics Corporation Data (CEC Data), one of China’s biggest telecommunications equipment maker.

Chinese Internet security firm 360 Technology Co. Ltd., Qianhai Wutong Mergers and Acquisition Funds, and Hanfor Capital Management Ltd, an private equity arm of Hanfor Holdings Ltd., also participated in the round, according to Unisound’s announcement on its officiel WeChat account.

Founded in 2012, Beijing-based Unisound provides voice recognition, language processing and big data solutions to Internet of Tings (IoT) devices such as home appliances, automobiles, healthcare and education products. This month, the firm will release its AI chip, which it has spent three years developing for IoT.

"Unisound has leading AI and chip technologies that have been tested by a large number of customers. Its smart medical solutions also matches China Electronics Health Fund’s investment strategy. We will work on voice recognition in the medical industry and co-develop new products and property rights to target AI chips for the healthcare industry," said China Electronics Health Fund.

The proceeds of this round will be used for research and development for AI technologies and chips, as well as business expansion, Unisound said in the announcement.

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uniOne chip for audio processing from unisound is an integrated AI ASIC+DSP. all chip cores are created by them.


UCReYFc.jpg
 
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SMIC to start risk production of 14nm FinFET process in 1H19
Cindy Yu, Taipei; Willis Ke, DIGITIMES
Friday 11 May 2018

Semiconductor Manufacturing International Corp (SMIC), the largest China-based foundry house, will kick off risk production of its 14nm FinFET process and venture into the AI (artificial intelligence) chip sector in the first half of 2019 after entering volume production of 28nm HKC+ process in the second half 2018, according to the firm's co-CEO Liang Mong-song.

Liang said at a recent investor conference that SMIC will see an upper single-digit shipment ratio for 28nm process for the whole 2018, with the volume production of its 28nm HKC process to run close to that of its 28nm Poly-SiON process.

In terms of mature process platforms, Liang highlighted the performance upgrades of power management IC process platform, saying that capacities at all its 8-inch wafer fabs are running tight to meet ever-increasing demand for power management ICs including IGBT devices. He added that the high-voltage BCD (bipolar CMOS DMOS) process will be shifted to 12-inch fabs.

Liang also stressed that SMIC will step up its technological developments, aiming to build a comprehensive process platform integrating technologies, IP and design services. In particular, he disclosed, SMIC will move to develop complete AI-based ASIC IPs in the first half of 2019 to provide customers with total IC design solutions.

Sequential 7-9% revenue growth for 2Q18


On the same occasion, another co-CEO Zhao Haijun said SMIC posted better-than-expected revenue performances, continuous growth in market demand and increased capacity utilization in the first quarter of 2018.

Zhao said SMIC raked in revenues of US$831 million for the quarter, including revenues from photomask production, wafer test and other technology royalty incomes. The quarter's gross profits reached US$220.2 million for a margin rate of 26.5%. The company expected a sequential 7-9% revenue growth for the second quarter of 2018, with gross margin to be in the range of 23-25%.

SMIC has expanded the capacity at its 8-inch fab in Shenzhen to 447,750 wafers in the first quarter of 2018 from 442,750 of a quarter earlier, and the average capacity utilization rate has risen to 88.3%.

SMIC posted R&D expenses and capital expenses at US$123 million and US$322 million, respectively, for the first quarter of 2018.

Zhao also disclosed that SMIC now sees 40% of its revenues from the China market, and is in a good position to benefit from the growing popularity of consumer electronics and IoT devices.

In particular, he stressed, SMIC has led in providing foundry services for makers of power management ICs and image sensing devices, and will enjoy a 30% growth in the NOR/NAND flash foundry business in 2018.



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another unicorn :D

chinamoneynetwork.com
Chinese AI Firm Unisound Raises $100M Series C Round Led By China Electronics Health Fund – China Money Network
2-3 minutes


UniHome is one of Unisound's solutions that enable home appliances to be "smart". For example, Unisound powers the voice command functions for refrigerators produced by some Chinese brands.

Chinese artificial intelligence (AI) solution provider Unisound announced that it has raised a US$100 million series C round led by China Electronics Health Fund, a fund established by China Electronics Corporation Data (CEC Data), one of China’s biggest telecommunications equipment maker.

Chinese Internet security firm 360 Technology Co. Ltd., Qianhai Wutong Mergers and Acquisition Funds, and Hanfor Capital Management Ltd, an private equity arm of Hanfor Holdings Ltd., also participated in the round, according to Unisound’s announcement on its officiel WeChat account.

Founded in 2012, Beijing-based Unisound provides voice recognition, language processing and big data solutions to Internet of Tings (IoT) devices such as home appliances, automobiles, healthcare and education products. This month, the firm will release its AI chip, which it has spent three years developing for IoT.

"Unisound has leading AI and chip technologies that have been tested by a large number of customers. Its smart medical solutions also matches China Electronics Health Fund’s investment strategy. We will work on voice recognition in the medical industry and co-develop new products and property rights to target AI chips for the healthcare industry," said China Electronics Health Fund.

The proceeds of this round will be used for research and development for AI technologies and chips, as well as business expansion, Unisound said in the announcement.

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uniOne chip for audio processing from unisound is an integrated AI ASIC+DSP. all chip cores are created by them.


UCReYFc.jpg


Few points for people who don't know much about the industry:
  1. SMIC has now been promising 14nm FinFET production for many years. You can go back in this very thread to look up all their past claims, none of which have come to any fruition.
  2. Even if one were to take their claim as they say it, it is risk production in 1H19. Actual commercial mass production should be expected only in late 2019, or even 2020.
  3. TSMC has already started production for 7 nm, and will begin production for 3 nm node by 2020. This means that SMIC will be 3-4 generations behind TSMC.
  4. Claiming an AI ASIC, and DSP is different than making one that is competitive in the market and technologically advanced enough. I will reserve my judgement, until the product actually gains market share.
 
Few points for people who don't know much about the industry:
  1. SMIC has now been promising 14nm FinFET production for many years. You can go back in this very thread to look up all their past claims, none of which have come to any fruition.
  2. Even if one were to take their claim as they say it, it is risk production in 1H19. Actual commercial mass production should be expected only in late 2019, or even 2020.
  3. TSMC has already started production for 7 nm, and will begin production for 3 nm node by 2020. This means that SMIC will be 3-4 generations behind TSMC.
  4. Claiming an AI ASIC, and DSP is different than making one that is competitive in the market and technologically advanced enough. I will reserve my judgement, until the product actually gains market share.

https://asia.nikkei.com/Business/Co...en-tool-to-close-gaps-with-Intel-TSMC-Samsung

:coffee::D

Tuesday, May 15, 2018

Chinese Chipmaker SMIC Orders $120m EUV System


SMIC_logo.jpg


Semiconductor Manufacturing International Co. (SMIC), China's top state-backed contract chipmaker, has reportedly ordered a set of extreme-ultraviolet lithography equipment from Dutch ASML.

SMIC's reserved EUV system is expected to be delivered by early 2019, according to Nikkei Asian Review.

The move highlights its growing ambition to help boost Chinese homegrown semiconductor manufacturing technology, even though it is still two to three generations behind market leaders.

All top global chip giants, including Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. are buying EUV equipment to ensure the later production of more advanced chips.

TSMC, the world's biggest contract chipmaker by revenue, for instance, has booked up to 10 systems for this year. Samsung has booked roughly six EUV systems, while Intel will take about three for 2018, according to sources quoted by Nikkei. GlobalFoundries, the world's No. 2 contract chipmaker, also placed an order for one.

The order by SMIC in April came after the U.S. said it will ban Chinese telecommunications equipment maker ZTE from using American-made components and services for seven years.

The U.S. and China are currently negotiating trade issues. U.S.

SMIC counts Qualcomm, Huawei's chip arm Hisilicon Technologies, and other chip designers as clients.

But the company is roughly two to three generations behind TSMC, Samsung and Intel in terms of manufacturing technology. It is still working to improve its own 28-nanometer process technology and last year brought in Liang Mong-song, a former senior executive at Samsung and TSMC, to be its co-chief executive to help develop its 14-nanometer process technology. Samsung and TSMC are now racing to manufacture 7-nanometer chips.

The EUV system works by projecting the light through a blueprint. Using a series of complex optics, made by German company Zeiss, the pattern is reduced and focused onto a thin slice of silicon coated with a light-sensitive chemical. The light interacts with the chemical effectively printing the pattern onto the silicon or wafer. When the unwanted silicon is etched away a three-dimensional structure is created. This is repeated dozens of times, layer upon layer, leaving a grid of hundreds of chips on one silicon wafer.

The light has to be focused in a vacuum to stop it being absorbed by air -- a difficult technological feat -- and the parameters are so small that the machine is working to within the size of an atom.

The tiniest speck of dust infiltrating the machine could ruin the design, leaving blank spaces on the chips.
 
ethereumworldnews
Bitcoin Mining Hardware Giant Files For $1 Billion IPO
Canaan Inc. controls 15 percent of the Bitcoin mining hardware market
By Conor Maloney Last updated May 16, 2018


The world’s second-largest bitcoin mining hardware manufacturer, Canaan Inc, has filed for a billion dollar IPO and submitted a listing application to the Hong Kong stock exchange.

Bloomberg reports that Canaan aims to start trading in July, and that the proposal is sponsored by Morgan Stanley, Deutsche Bank AG, CMB International Capital Ltd, and Credit Suisse Group AG.

The company filed for an IPO in 2016 in mainland China but had to cancel the plans due to a regulatory deadlock. Canaan also considered listing on the National Equities Exchange and Quotations OTC market known as the New Third Board before scrapping the plans in favor of the Hong Kong ICO.

Founded in 2013, Canaan is based in Hong Kong and reported a revenue of $205 million last year, while net income saw a sixfold increase to over $56 million. A successful listing would make Canaan the first Hong Kong IPO in cryptocurrency.

A February report from Sanford C. Bernstein & Co. indicates that Canaan has around 15 percent of the global bitcoin mining hardware market, including chips and computer equipment, with rival company Bitmain reportedly controlling 70 percent. A third competitor is “Bitfury” based in the US. China introduced tax breaks for microchip manufacturers in March to reduce dependence on foreign semiconductors amid trade tensions with the US, leading to a spike in overseas acquisitions bby Chinese chipmakers.

Canaan has 200 employees in Beijing and Hangzhou – th company sells ASIC mining chips and other equipment under the “Avalon” brand. Co-Chairman Jianping Kong stated in April that much of the company hardware is sold for use in electricity-rich areas in China and inner Mongolia where some of the world’s largest Bitcoin mines can be found.

The company is developing AI chips and considering expanding their operations to mine other currrencies as well, such as Litecoin. Canaan is also looking into new products to add to their arsenal, such as home appliances such as televisions with bitcoin mining capabilities to allow customers to use them for household purposes during the day only for them to mine cryptocurrencies “while you sleep” as well.

Shandong Luyitong Intelligent Electric Plc sought to acquire Canaan in 2016, but the deal was cancelled due to “great uncertainties” regarding China’s regulatory policies regarding cryptocurrencies and securities. In China the ASIC-based blockchain hardware market has increased from $7.8 million in 2013 to $1.1 billion last year. Frost&Sullivan consultants predict that it will reach over $4.4 billion by 2020 based on the current growth trends.

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medium.com
China’s Voice Tech AI Startup Unisound Raises US$100 Million to Boost IoT Services

2-3 minutes

Beijing-based artificial intelligence startup Unisound, (a.k.a. Yunzhisheng / 云知声) today announced that it had raised US$100 million in Series C funding, the richest-ever single funding round for a smart voice technology startup.

The investment was led by CLP Health Fund, joined by 360 Technology, Qianhai Wutong M&A Fund, Hanfor Capital, etc. Chinese media also reported that the company has already started its agenda-setting Series C+ funding.

Founded in 2012, Unisound aims at making Internet of Things (IoT) devices smarter by adding AI capabilities such as voice recognition, language processing, knowledge computing and big data solutions.

In a 2016 interview with Synced, Unisound Founder and CEO Huang Wei laid out his company’s ambitious “Chip+Edge+Cloud” strategy for producing processors and sensors to empower edge devices, enabling voice-activated interactions for users, and connecting edge devices with Unisound’s cloud-based intelligent platform.

Unisound puts a particular emphasis on smart home appliances, vehicles, and healthcare. Last month, Unisound and Shanghai-based Phicomm jointly launched the smart speaker R1, which leverages cutting-edge voice recognition and semantic analysis techniques to better understand human speech.

The company accounts for more than 70 percent of the aftermarket share in China’s automotive field, and its voice interaction solutions for healthcare are deployed in more than 60 major Chinese hospitals. Unisound’s supercomputer platform has reached a benchmark performance of 10 petaflops.

Last year, Unisound received CNY¥300 million (US$45 million) in investments for development of its first AI chip, UniOne, which will be released on May 16.

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4.7-bln-USD China AMOLED display facility goes into operation
Source: Xinhua| 2018-05-17 23:53:27|Editor: Mu Xuequan


SHIJIAZHUANG, May 17 (Xinhua) -- A 6th-generation flexible AMOLED display screen production line, which involved an investment of nearly 30 billion yuan (4.7 billion U.S. dollars), went into operation Thursday in north China's Hebei Province.

The production line of Visionox Co., in an industrial park in Langfang City, south of Beijing, can meet the demand of nearly 100 million smartphones for high-end screens.

Visionox, which has more than 3,500 OLED patents, grew out of the OLED project team of Tsinghua University. It was the first Chinese firm to participate in the formulating of the global flexible display screen standard, according to Visionox president Zhang Deqiang.

The production line is expected to start mass production in the second half of the year with a monthly production of 30,000 glass substrates (1,500mm by 1,850mm).

Chinese firms previously relied heavily on imports for high-end display products, such as curved and foldable screens.

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