Opinionated - China Chipping Away to Semiconductor Dominance
- Thread starter Martian2
- Start date
even china has technologies in place as alternatives, most chinese local companies would still choose foreign sources because of 'foreign sh1t better than china' mentality. now trump has opened their eyes wide & clear; they could go bankrupt if they don't make sh1t themselves or give local companies a chance to grow and improve. this is a blessing in disguise. more and more companies now investing in chip making business. everyday you hear company from another industry jumping into chip industry. all thanks trumpWow, who says Trump really hates China?
I wonder if it was really Russians getting Trump elected.
I would suggest DP to look more closely at Trump-CPC relations.
***
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Bussard Ramjet
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even china has technologies in place as alternatives, most chinese local companies would still choose foreign sources because of 'foreign sh1t better than china' mentality. now trump has opened their eyes wide & clear, they could go bankrupt if they don't make sh1t themselves or give local companies a chance to grow and improve. this is a blessing in disguise. more and more companies now investing chip making business. everyday you hear company from another industry jumping into chip industry. all thanks trump
Not true. In fact, most Chinese companies will immediately choose a Chinese supplier if they reach the quality that they need. And examples are aplenty:
- AMEC- It has been making MOCVDs for many many years, but its MOCVDs weren't deemed good enough. However, in 2017, it was able to reach a level where it can deliver good MOCVDs. Immediately it got so many orders from local suppliers, that within one year, it leapfrogged Vecco to become the largest MOCVD vendor.
- Goodix- Almost all Chinese companies place their fingerprint scanner order here.
- AAC- Every Chinese company places their order for acoustics and haptics here.
- BOE- It has only got Chinese customers as of now, who introduce its products in both low and medium end devices.
This is a very good article, and everyone should read this one:
https://asia.nikkei.com/Spotlight/C...ompanies-aim-to-topple-Samsung-Intel-and-TSMC
JSCh
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China Invites Foreign Cash to Build a World-Class Chip Industry
Bloomberg News
25 April 2018, 13:37 GMT+8
As part of efforts to reduce an overwhelming reliance on foreign technology, the Chinese government set up a fund that aims to raise up to 200 billion yuan ($31.7 billion) to back a spectrum of domestic firms from processor designers to equipment makers. The China Integrated Circuit Industry Investment Fund Co. will now take foreign money, the country’s tech industry overseer said Wednesday.
“The second phase of the national IC fund is still raising money. We welcome overseas companies to participate in the fund,” Chen Yin, general engineer and spokesman of the Ministry of Industry and Information Technology, told reporters in Beijing.
Semiconductors lie at the heart of a spat between the world’s two largest economies, a dispute that’s swelling tariffs, chilling Chinese investments in American companies and hampering the Asian nation’s development of technologies from fifth-generation wireless to artificial intelligence. The U.S. government is even reviewing the possible use of a 1977 law under which President Donald Trump could declare a national emergency, block transactions and seize assets.
Along with the U.S. blacklisting of ZTE Corp. for seven years, that only reminded Beijing of the urgent need to whittle down its dependency on American technologies. The action taken against ZTE has ironically galvanized China’s existing plan to shell out some $150 billion over 10 years to achieve a leading position in chip design and manufacturing -- a vision that U.S. executives and officials have repeatedly warned could harm American interests.
Semiconductor Manufacturing International Corp. Investors in the initial vehicle were mainly central and local governments and state-owned enterprises. It’s unclear whether the MIIT has entertained any foreign approaches.
“China has a vast electronics information market and we will continue to take the path of innovation and international cooperation,” Chen said. “We will push for quicker breakthroughs in key technologies.”
— With assistance by Yuan Gao
China Invites Foreign Cash to Build a World-Class Chip Industry - Bloomberg
Bloomberg News
25 April 2018, 13:37 GMT+8
- Beijing takes foreign money for its second chip-sector fund
- The surprise announcement comes as U.S.-China tensions simmer
As part of efforts to reduce an overwhelming reliance on foreign technology, the Chinese government set up a fund that aims to raise up to 200 billion yuan ($31.7 billion) to back a spectrum of domestic firms from processor designers to equipment makers. The China Integrated Circuit Industry Investment Fund Co. will now take foreign money, the country’s tech industry overseer said Wednesday.
“The second phase of the national IC fund is still raising money. We welcome overseas companies to participate in the fund,” Chen Yin, general engineer and spokesman of the Ministry of Industry and Information Technology, told reporters in Beijing.
Semiconductors lie at the heart of a spat between the world’s two largest economies, a dispute that’s swelling tariffs, chilling Chinese investments in American companies and hampering the Asian nation’s development of technologies from fifth-generation wireless to artificial intelligence. The U.S. government is even reviewing the possible use of a 1977 law under which President Donald Trump could declare a national emergency, block transactions and seize assets.
Along with the U.S. blacklisting of ZTE Corp. for seven years, that only reminded Beijing of the urgent need to whittle down its dependency on American technologies. The action taken against ZTE has ironically galvanized China’s existing plan to shell out some $150 billion over 10 years to achieve a leading position in chip design and manufacturing -- a vision that U.S. executives and officials have repeatedly warned could harm American interests.
Semiconductor Manufacturing International Corp. Investors in the initial vehicle were mainly central and local governments and state-owned enterprises. It’s unclear whether the MIIT has entertained any foreign approaches.
“China has a vast electronics information market and we will continue to take the path of innovation and international cooperation,” Chen said. “We will push for quicker breakthroughs in key technologies.”
— With assistance by Yuan Gao
China Invites Foreign Cash to Build a World-Class Chip Industry - Bloomberg
xpeng motor, dji, didi, byton, nio and few other self-driving startups choose mobileye and movidius over their own companies. the funny thing is those that interested in chinese chips are from foreign companies. ridiculous.. i bet those fu<kers probably running round from one chinese chip startup to another right now looking for replacement after that zte ban..
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cirr
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Wow, who says Trump really hates China?
I wonder if it was really Russians getting Trump elected.
I would suggest DP to look more closely at Trump-CPC relations.
***
工信部：集成电路发展基金正二期募资 欢迎企业参与
2018-04-25 17:09:14
关键字:集成电路发展基金募集基金集成电路二期4G用户芯片设计
【观察者网 综合报道】集成电路产业是一个技术密集型、人才密集型和资金密集型产业。近来的中兴事件让人们再度关心中国集成电路的发展。25日，工业和信息化部总工程师、新闻发言人陈因在北京透露，中国正在进行集成电路发展基金二期募集。
当天，国务院新闻办公室举行一季度工业通信业发展情况新闻发布会。
会上，工业和信息化部总工程师、新闻发言人陈因介绍了今年一季度工业和通信业的发展情况，称一季度4G用户总数达10.5亿户，4G用户总数占移动电话用户总数的72.2%，电信业务收入同比增长5.1%。
在答记者问环节，彭博社记者提问：中国发展半导体的计划是否会受到美国近期对中兴制裁的影响，在此基础上，中方是否会提高在集成电路方面的资金投入，尤其是在集成电路二期投入方面，会不会加大这方面的资金投入？
陈因回答，相信大家已经注意到，我们商务部和外交部已经对中兴作出了回应，表明了中方的立场。集成电路产业是一个技术密集型、人才密集型和资金密集型产业。
他说，近年来，在市场需求的拉动下，我国集成电路产业快速发展，整体实力显著增强，产业规模快速发展壮大。但是在芯片设计、制造能力和人才队伍方面还存在着差距，需要进一步加快发展。中国的电子产业信息市场广阔，我们将坚持走创新发展和开放合作的道路，加快推动核心技术的突破，加强国际间产业的合作，我们有信心与世界各国一道，为人类发展谋福祉、共进步。
“您刚才问到我们集成电路发展基金，现在正在进行第二期募集资金，我们也欢迎各方企业参与我们基金的募集。”陈因说。
国家集成电路产业投资基金 一期投资晶圆制造
2014年10月，工信部网站发布公告，国家集成电路产业投资基金（简称“大基金”）于9月24日正式设立，该基金将采取股权投资等多种形式，重点投资集成电路芯片制造业，兼顾芯片设计、封装测试、设备和材料等产业。
大基金采取公司制形式。国开金融、中国烟草、亦庄国投、中国移动、上海国盛、中国电科、紫光通信、华芯投资等作为发起人，吸引大型企业、金融机构以及社会资金，共同投资设立国家集成电路产业投资基金股份有限公司。
大基金将采取股权投资等多种形式，重点投资集成电路芯片制造业，兼顾芯片设计、封装测试、设备和材料等产业，推动企业提升产能水平和实行兼并重组、规范企业治理，形成良性自我发展能力。
晶圆制造是大基金一期的重点投资领域。根据国际半导体产业协会（SEMI）的数据统计，预估在2017年-2020年间，全球将有62座新的晶圆厂投入营运。期间国内将有26座新的晶圆厂投入营运，占新增晶圆厂比重高达42%。
“从产业发展角度看，并不需这么多地方建晶圆厂，并且一些地方不具备建厂条件。晶圆厂遍地开花值得警惕，相当部分晶圆厂未来可能慢慢倒闭，或者被大厂合并。”《中国证券报》援引清华大学微电子研究所所长、中国半导体行业协会IC设计分会理事长魏少军的话说。
魏少军还说，“三星、美光、海力士等海外厂商近段时间把存储器价格抬得很高，同时疯狂投资建厂。我怀疑这是一种策略，把价格炒高，把钱赚到手。等我们量产的产品出来了，又来打压价格。因此，2019年国内企业产品量产后，将面对严酷的竞争形势。但这个痛苦的坎儿必须迈过去。”
据悉，大部分国内在建晶圆生产线将于2018年—2020年实现量产，随之而来的则是良率爬坡以及更为残酷的国际竞争格局。
虽然竞争残酷，但国家大基金董事长王占甫表示，截至2017年11月30日，大基金已经累计有效决策62个项目，涉及46家企业；累计有效承诺额1063亿元，实际出资794亿元。目前大基金在制造、设计、封测、装备材料等产业链各环节投资布局全覆盖，各环节承诺投资占总投资的比重分别为63%、20%、10%、7%。前三位企业的投资占比达70%以上，有力推动龙头企业核心竞争力提升。
王占甫介绍，据初步测算，未来五年全行业总资金需求约为1.15万亿-1.4万亿元，对基金需求规模约为1700亿-2100亿元。
二期资金规模更大 并购整合机遇来临
今年3月，《中国证券报》报道称，记者获悉，国家集成电路产业投资基金（简称“大基金”）第二期正在紧锣密鼓募资之中。目前方案已上报国务院并获批。
接近大基金的消息人士透露，大基金二期筹资规模超过一期，在1500亿-2000亿元左右。按照1∶3的撬动比，所撬动的社会资金规模在4500亿-6000亿元左右。加上大基金第一期1387亿元及所撬动的5145亿元社会资金，资金总额将过万亿元。
对于大基金第二期的投资方向，北京清芯华创投资公司投委会主席陈大同提出两方面建议：第一，应适当放宽投资标的，集成电路下游应用终端平台企业应该获得支持，有利于培育产业环境，拉动市场需求；第二，大基金第一期的子基金投资额度太少，只有100亿元，约7%；应该增加至15%，才能形成以大基金为航母，各具特色的子基金为护卫舰、驱逐舰的舰队，充分发挥大基金的龙头作用。
陈大同所在北京清芯华创投资公司就管理着北京市集成电路产业基金旗下的设计与封测子基金。
魏少军表示，大基金第二期可以设立并购整合基金，引导行业提高集中度，培育行业龙头。目前中国1380家芯片设计企业数量过多，单家企业竞争力不强。“所有设计企业的营收总和都不及英特尔一家公司一年的研发投入。未来5-10年，中国集成电路行业集中度将不断提升，留下200家设计企业比较合适。”
大基金有助于解决制约产业发展的投融资瓶颈，但难以解决所有问题。比如，人才稀缺问题。国家大基金副总裁韦俊说，大基金曾委托第三方机构做过一个调研，2016年全国半导体行业从业人员约40万人。按照集成电路产业规划发展要求，到2020年行业至少需要80万人。“目前高校每年培养的与半导体沾边的大学生仅三万多人，人才缺口很大。”
魏少军介绍，在现有架构下，处理器领域国内企业十年内难以超越英特尔，研发投入的差距是一方面，人才不足也是重要因素。“全国从事处理器研发相关人员加起来少于2000人。”
多位专家表示，除了大基金及其所撬动的社会资金，集成电路作为先进制造业需要资本市场更多支持。近四年来，海外回归的半导体企业尚无一例进入中国资本市场。
陈大同曾是豪威科技和展讯的创始人之一，进入投资领域后曾主导完成豪威科技的私有化，并试图将豪威科技注入A股上市公司。但受政策等因素影响最终未能成行。豪威科技是图像传感器芯片制造领域龙头企业，目前市占率仅次于索尼和三星，位列全球第三。
与传统制造业不同，集成电路产业运作系统复杂，16nm制程工艺集成约33亿个晶体管，设备动辄上亿元，生产线动辄百亿元。稍有不慎，巨额投入就会打水漂。但集成电路产业撬动能力可观，1美元的集成电路能带动的GDP相当于100美元。从全球范围看，经济强国大多倾举国之力发展这一战略产业。
@Bussard Ramjet
Bussard Ramjet
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工信部：集成电路发展基金正二期募资 欢迎企业参与
2018-04-25 17:09:14
关键字:集成电路发展基金募集基金集成电路二期4G用户芯片设计
【观察者网 综合报道】集成电路产业是一个技术密集型、人才密集型和资金密集型产业。近来的中兴事件让人们再度关心中国集成电路的发展。25日，工业和信息化部总工程师、新闻发言人陈因在北京透露，中国正在进行集成电路发展基金二期募集。
当天，国务院新闻办公室举行一季度工业通信业发展情况新闻发布会。
会上，工业和信息化部总工程师、新闻发言人陈因介绍了今年一季度工业和通信业的发展情况，称一季度4G用户总数达10.5亿户，4G用户总数占移动电话用户总数的72.2%，电信业务收入同比增长5.1%。
在答记者问环节，彭博社记者提问：中国发展半导体的计划是否会受到美国近期对中兴制裁的影响，在此基础上，中方是否会提高在集成电路方面的资金投入，尤其是在集成电路二期投入方面，会不会加大这方面的资金投入？
陈因回答，相信大家已经注意到，我们商务部和外交部已经对中兴作出了回应，表明了中方的立场。集成电路产业是一个技术密集型、人才密集型和资金密集型产业。
他说，近年来，在市场需求的拉动下，我国集成电路产业快速发展，整体实力显著增强，产业规模快速发展壮大。但是在芯片设计、制造能力和人才队伍方面还存在着差距，需要进一步加快发展。中国的电子产业信息市场广阔，我们将坚持走创新发展和开放合作的道路，加快推动核心技术的突破，加强国际间产业的合作，我们有信心与世界各国一道，为人类发展谋福祉、共进步。
“您刚才问到我们集成电路发展基金，现在正在进行第二期募集资金，我们也欢迎各方企业参与我们基金的募集。”陈因说。
国家集成电路产业投资基金 一期投资晶圆制造
2014年10月，工信部网站发布公告，国家集成电路产业投资基金（简称“大基金”）于9月24日正式设立，该基金将采取股权投资等多种形式，重点投资集成电路芯片制造业，兼顾芯片设计、封装测试、设备和材料等产业。
大基金采取公司制形式。国开金融、中国烟草、亦庄国投、中国移动、上海国盛、中国电科、紫光通信、华芯投资等作为发起人，吸引大型企业、金融机构以及社会资金，共同投资设立国家集成电路产业投资基金股份有限公司。
大基金将采取股权投资等多种形式，重点投资集成电路芯片制造业，兼顾芯片设计、封装测试、设备和材料等产业，推动企业提升产能水平和实行兼并重组、规范企业治理，形成良性自我发展能力。
晶圆制造是大基金一期的重点投资领域。根据国际半导体产业协会（SEMI）的数据统计，预估在2017年-2020年间，全球将有62座新的晶圆厂投入营运。期间国内将有26座新的晶圆厂投入营运，占新增晶圆厂比重高达42%。
“从产业发展角度看，并不需这么多地方建晶圆厂，并且一些地方不具备建厂条件。晶圆厂遍地开花值得警惕，相当部分晶圆厂未来可能慢慢倒闭，或者被大厂合并。”《中国证券报》援引清华大学微电子研究所所长、中国半导体行业协会IC设计分会理事长魏少军的话说。
魏少军还说，“三星、美光、海力士等海外厂商近段时间把存储器价格抬得很高，同时疯狂投资建厂。我怀疑这是一种策略，把价格炒高，把钱赚到手。等我们量产的产品出来了，又来打压价格。因此，2019年国内企业产品量产后，将面对严酷的竞争形势。但这个痛苦的坎儿必须迈过去。”
据悉，大部分国内在建晶圆生产线将于2018年—2020年实现量产，随之而来的则是良率爬坡以及更为残酷的国际竞争格局。
虽然竞争残酷，但国家大基金董事长王占甫表示，截至2017年11月30日，大基金已经累计有效决策62个项目，涉及46家企业；累计有效承诺额1063亿元，实际出资794亿元。目前大基金在制造、设计、封测、装备材料等产业链各环节投资布局全覆盖，各环节承诺投资占总投资的比重分别为63%、20%、10%、7%。前三位企业的投资占比达70%以上，有力推动龙头企业核心竞争力提升。
王占甫介绍，据初步测算，未来五年全行业总资金需求约为1.15万亿-1.4万亿元，对基金需求规模约为1700亿-2100亿元。
二期资金规模更大 并购整合机遇来临
今年3月，《中国证券报》报道称，记者获悉，国家集成电路产业投资基金（简称“大基金”）第二期正在紧锣密鼓募资之中。目前方案已上报国务院并获批。
接近大基金的消息人士透露，大基金二期筹资规模超过一期，在1500亿-2000亿元左右。按照1∶3的撬动比，所撬动的社会资金规模在4500亿-6000亿元左右。加上大基金第一期1387亿元及所撬动的5145亿元社会资金，资金总额将过万亿元。
对于大基金第二期的投资方向，北京清芯华创投资公司投委会主席陈大同提出两方面建议：第一，应适当放宽投资标的，集成电路下游应用终端平台企业应该获得支持，有利于培育产业环境，拉动市场需求；第二，大基金第一期的子基金投资额度太少，只有100亿元，约7%；应该增加至15%，才能形成以大基金为航母，各具特色的子基金为护卫舰、驱逐舰的舰队，充分发挥大基金的龙头作用。
陈大同所在北京清芯华创投资公司就管理着北京市集成电路产业基金旗下的设计与封测子基金。
魏少军表示，大基金第二期可以设立并购整合基金，引导行业提高集中度，培育行业龙头。目前中国1380家芯片设计企业数量过多，单家企业竞争力不强。“所有设计企业的营收总和都不及英特尔一家公司一年的研发投入。未来5-10年，中国集成电路行业集中度将不断提升，留下200家设计企业比较合适。”
大基金有助于解决制约产业发展的投融资瓶颈，但难以解决所有问题。比如，人才稀缺问题。国家大基金副总裁韦俊说，大基金曾委托第三方机构做过一个调研，2016年全国半导体行业从业人员约40万人。按照集成电路产业规划发展要求，到2020年行业至少需要80万人。“目前高校每年培养的与半导体沾边的大学生仅三万多人，人才缺口很大。”
魏少军介绍，在现有架构下，处理器领域国内企业十年内难以超越英特尔，研发投入的差距是一方面，人才不足也是重要因素。“全国从事处理器研发相关人员加起来少于2000人。”
多位专家表示，除了大基金及其所撬动的社会资金，集成电路作为先进制造业需要资本市场更多支持。近四年来，海外回归的半导体企业尚无一例进入中国资本市场。
陈大同曾是豪威科技和展讯的创始人之一，进入投资领域后曾主导完成豪威科技的私有化，并试图将豪威科技注入A股上市公司。但受政策等因素影响最终未能成行。豪威科技是图像传感器芯片制造领域龙头企业，目前市占率仅次于索尼和三星，位列全球第三。
与传统制造业不同，集成电路产业运作系统复杂，16nm制程工艺集成约33亿个晶体管，设备动辄上亿元，生产线动辄百亿元。稍有不慎，巨额投入就会打水漂。但集成电路产业撬动能力可观，1美元的集成电路能带动的GDP相当于100美元。从全球范围看，经济强国大多倾举国之力发展这一战略产业。
@Bussard Ramjet
An English version please.
工信部：集成电路发展基金正二期募资 欢迎企业参与
2018-04-25 17:09:14
关键字:集成电路发展基金募集基金集成电路二期4G用户芯片设计
【观察者网 综合报道】集成电路产业是一个技术密集型、人才密集型和资金密集型产业。近来的中兴事件让人们再度关心中国集成电路的发展。25日，工业和信息化部总工程师、新闻发言人陈因在北京透露，中国正在进行集成电路发展基金二期募集。
当天，国务院新闻办公室举行一季度工业通信业发展情况新闻发布会。
会上，工业和信息化部总工程师、新闻发言人陈因介绍了今年一季度工业和通信业的发展情况，称一季度4G用户总数达10.5亿户，4G用户总数占移动电话用户总数的72.2%，电信业务收入同比增长5.1%。
在答记者问环节，彭博社记者提问：中国发展半导体的计划是否会受到美国近期对中兴制裁的影响，在此基础上，中方是否会提高在集成电路方面的资金投入，尤其是在集成电路二期投入方面，会不会加大这方面的资金投入？
陈因回答，相信大家已经注意到，我们商务部和外交部已经对中兴作出了回应，表明了中方的立场。集成电路产业是一个技术密集型、人才密集型和资金密集型产业。
他说，近年来，在市场需求的拉动下，我国集成电路产业快速发展，整体实力显著增强，产业规模快速发展壮大。但是在芯片设计、制造能力和人才队伍方面还存在着差距，需要进一步加快发展。中国的电子产业信息市场广阔，我们将坚持走创新发展和开放合作的道路，加快推动核心技术的突破，加强国际间产业的合作，我们有信心与世界各国一道，为人类发展谋福祉、共进步。
“您刚才问到我们集成电路发展基金，现在正在进行第二期募集资金，我们也欢迎各方企业参与我们基金的募集。”陈因说。
国家集成电路产业投资基金 一期投资晶圆制造
2014年10月，工信部网站发布公告，国家集成电路产业投资基金（简称“大基金”）于9月24日正式设立，该基金将采取股权投资等多种形式，重点投资集成电路芯片制造业，兼顾芯片设计、封装测试、设备和材料等产业。
大基金采取公司制形式。国开金融、中国烟草、亦庄国投、中国移动、上海国盛、中国电科、紫光通信、华芯投资等作为发起人，吸引大型企业、金融机构以及社会资金，共同投资设立国家集成电路产业投资基金股份有限公司。
大基金将采取股权投资等多种形式，重点投资集成电路芯片制造业，兼顾芯片设计、封装测试、设备和材料等产业，推动企业提升产能水平和实行兼并重组、规范企业治理，形成良性自我发展能力。
晶圆制造是大基金一期的重点投资领域。根据国际半导体产业协会（SEMI）的数据统计，预估在2017年-2020年间，全球将有62座新的晶圆厂投入营运。期间国内将有26座新的晶圆厂投入营运，占新增晶圆厂比重高达42%。
“从产业发展角度看，并不需这么多地方建晶圆厂，并且一些地方不具备建厂条件。晶圆厂遍地开花值得警惕，相当部分晶圆厂未来可能慢慢倒闭，或者被大厂合并。”《中国证券报》援引清华大学微电子研究所所长、中国半导体行业协会IC设计分会理事长魏少军的话说。
魏少军还说，“三星、美光、海力士等海外厂商近段时间把存储器价格抬得很高，同时疯狂投资建厂。我怀疑这是一种策略，把价格炒高，把钱赚到手。等我们量产的产品出来了，又来打压价格。因此，2019年国内企业产品量产后，将面对严酷的竞争形势。但这个痛苦的坎儿必须迈过去。”
据悉，大部分国内在建晶圆生产线将于2018年—2020年实现量产，随之而来的则是良率爬坡以及更为残酷的国际竞争格局。
虽然竞争残酷，但国家大基金董事长王占甫表示，截至2017年11月30日，大基金已经累计有效决策62个项目，涉及46家企业；累计有效承诺额1063亿元，实际出资794亿元。目前大基金在制造、设计、封测、装备材料等产业链各环节投资布局全覆盖，各环节承诺投资占总投资的比重分别为63%、20%、10%、7%。前三位企业的投资占比达70%以上，有力推动龙头企业核心竞争力提升。
王占甫介绍，据初步测算，未来五年全行业总资金需求约为1.15万亿-1.4万亿元，对基金需求规模约为1700亿-2100亿元。
二期资金规模更大 并购整合机遇来临
今年3月，《中国证券报》报道称，记者获悉，国家集成电路产业投资基金（简称“大基金”）第二期正在紧锣密鼓募资之中。目前方案已上报国务院并获批。
接近大基金的消息人士透露，大基金二期筹资规模超过一期，在1500亿-2000亿元左右。按照1∶3的撬动比，所撬动的社会资金规模在4500亿-6000亿元左右。加上大基金第一期1387亿元及所撬动的5145亿元社会资金，资金总额将过万亿元。
对于大基金第二期的投资方向，北京清芯华创投资公司投委会主席陈大同提出两方面建议：第一，应适当放宽投资标的，集成电路下游应用终端平台企业应该获得支持，有利于培育产业环境，拉动市场需求；第二，大基金第一期的子基金投资额度太少，只有100亿元，约7%；应该增加至15%，才能形成以大基金为航母，各具特色的子基金为护卫舰、驱逐舰的舰队，充分发挥大基金的龙头作用。
陈大同所在北京清芯华创投资公司就管理着北京市集成电路产业基金旗下的设计与封测子基金。
魏少军表示，大基金第二期可以设立并购整合基金，引导行业提高集中度，培育行业龙头。目前中国1380家芯片设计企业数量过多，单家企业竞争力不强。“所有设计企业的营收总和都不及英特尔一家公司一年的研发投入。未来5-10年，中国集成电路行业集中度将不断提升，留下200家设计企业比较合适。”
大基金有助于解决制约产业发展的投融资瓶颈，但难以解决所有问题。比如，人才稀缺问题。国家大基金副总裁韦俊说，大基金曾委托第三方机构做过一个调研，2016年全国半导体行业从业人员约40万人。按照集成电路产业规划发展要求，到2020年行业至少需要80万人。“目前高校每年培养的与半导体沾边的大学生仅三万多人，人才缺口很大。”
魏少军介绍，在现有架构下，处理器领域国内企业十年内难以超越英特尔，研发投入的差距是一方面，人才不足也是重要因素。“全国从事处理器研发相关人员加起来少于2000人。”
多位专家表示，除了大基金及其所撬动的社会资金，集成电路作为先进制造业需要资本市场更多支持。近四年来，海外回归的半导体企业尚无一例进入中国资本市场。
陈大同曾是豪威科技和展讯的创始人之一，进入投资领域后曾主导完成豪威科技的私有化，并试图将豪威科技注入A股上市公司。但受政策等因素影响最终未能成行。豪威科技是图像传感器芯片制造领域龙头企业，目前市占率仅次于索尼和三星，位列全球第三。
与传统制造业不同，集成电路产业运作系统复杂，16nm制程工艺集成约33亿个晶体管，设备动辄上亿元，生产线动辄百亿元。稍有不慎，巨额投入就会打水漂。但集成电路产业撬动能力可观，1美元的集成电路能带动的GDP相当于100美元。从全球范围看，经济强国大多倾举国之力发展这一战略产业。
@Bussard Ramjet
From what I can understand from Google Translate, even this article is talking about how, Intel's R&D investment alone is greater than all Chinese design companies' revenue etc.
While the money is there no doubt, it takes time, and a lot of skill and talent, and decades of work.
Who’s the Lidar IP Leader?
Junko Yoshida
4/23/2018 00:01 AM EDT
"Pierre Cambou, activity leader for imaging and sensors at market-research firm Yole Développement (Lyon, France), said he can’t imagine a robotic vehicle without lidars.
Qualcomm, LG Innotek, Ricoh and Texas Instruments.. contributions are “reducing the size of lidars” and “increasing the speed with high pulse rate” by using non-scanning technologies. Quanergy, Velodyne, Luminar and LeddarTech... focus on highly specific patented technology that leads to product assertion and its application. Active in the IP landscape are Google, Waymo, Uber, Zoox and Faraday Future. Chinese giants such as Baidu and Chery also have lidar IPs.
Notable is the emergence of lidar IP players in China. They include LeiShen, Robosense, Hesai, Bowei Sensor Tech."
-----
Junko Yoshida
4/23/2018 00:01 AM EDT
"Pierre Cambou, activity leader for imaging and sensors at market-research firm Yole Développement (Lyon, France), said he can’t imagine a robotic vehicle without lidars.
Qualcomm, LG Innotek, Ricoh and Texas Instruments.. contributions are “reducing the size of lidars” and “increasing the speed with high pulse rate” by using non-scanning technologies. Quanergy, Velodyne, Luminar and LeddarTech... focus on highly specific patented technology that leads to product assertion and its application. Active in the IP landscape are Google, Waymo, Uber, Zoox and Faraday Future. Chinese giants such as Baidu and Chery also have lidar IPs.
Notable is the emergence of lidar IP players in China. They include LeiShen, Robosense, Hesai, Bowei Sensor Tech."
Code:
https://www.eetimes.com/document.asp?doc_id=1333200-----
Bussard Ramjet
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I was just going through this thread again, and I see this statement on the first page itself!
Needless to say that 14nm isn't even within sight two years later!
So basically SMIC completely failed on its own target to deliver technology. It promised in 2014 that it would have 14nm FinFet by 2016, but nothing happened.
Bussard Ramjet
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It seems that you don't really know how significant a business foundries are, and how high tech they are.
In fact, Taiwan still has better chip companies even on the design side in some areas. (but I do expect China to surpass them soon)
Also, South Korea is a giant in Display, and Memory; both of these are highly technical fields. Memory involves both design and fabrication.
SMIC will leapfrog 22nm node and be only 1-1.5 generation behind the top players by 2018 or 2019.
SMIC’s 28nm Process Puts the Pressure on UMC
Peter Brown
12 August 2015
Semiconductor Manufacturing International Corp.’s (SMIC) has announced that its 28 nanometer (nm) process technology has been successfully adopted into mainstream smartphones. This marks a significant step in the commercial usage of 28nm core chips and a new era of advanced mobile phone chip manufacturing in China.
That puts SMIC in a good position to appeal to the Chinese government’s demand to increase domestic electronics content (Read: Why China Is Shopping for Silicon Valley Chip Companies). However, it also places a heavy burden on competing foundry United Microelectronics Corp. (UMC)
While SMIC is still several generations behind the likes of Taiwan Semiconductor Manufacturing Corp. (TSMC) and Globalfoundries that are both qualified for 20nm and 14nm production, the Chinese foundry is only slightly behind UMC, which has been in volume production of 28nm chips for six quarters.
Len Jelinek, senior director of semiconductor manufacturing at IHS.“The key question is can [SMIC] surpass UMC in terms of 28nm revenue?” ask Len Jelinek, senior director of semiconductor manufacturing at IHS. “I believe with the pressure being placed by the Chinese government that within a year or so, SMIC may be able to significantly increase their revenue on 28nm and possibly surpass UMC’s revenue,” he says.
Jelinek says the SMIC process technology is a big deal since the company had to develop the technology independently, as Taiwan is not allowed to transfer technology to mainland China. While SMIC is the only foundry currently at this manufacturing process node, it may not be for long as Shanghai Huali Microelectronics Corp. is also working to develop and qualify 28nm technology.
SMIC’s 28nm process technology is being used initially to manufacture Qualcomm’s Snapdragon 410 processors for use in smartphones. While SMIC claims this is a pivotal step toward advancing mobile phone chip manufacturing in China, Qualcomm could elect to use the chips globally as well. However, Jelinek believes this might not be the case.
“Given the strong desire of the Chinese government to have domestic suppliers, I would think that Qualcomm would preferentially provide these chips to domestic suppliers,”
Qualcomm and SMIC have developed the first 28nm process in China. Source: SMIC
Dr. Tzu-yin Chiu, CEO and executive director at SMIC, says in a statement that for the first time China’s mainland manufacturers will be able to introduce mainstream smartphones that are the result of the close collaboration between a Chinese foundry and smartphone chip maker built domestically.
Chiu says SMIC will work on developing more advanced processing technologies in the future in order to meet the demand from the domestic mainland. In fact, Qualcomm and SMIC have already formed an agreement—along with research institute IMEC and wireless technology giant Huawei—to develop a 14nm process (Read: SMIC, Qualcomm, IMEC in 14nm Process Development
SMIC’s 28nm Process Puts the Pressure on UMC - IHS Electronics360
That statement turned out to be completely false. Right now in 2018, SMIC is still trying to mature its 28nm process on the other hand, TSMC has begun initial production at 7nm.
Bussard Ramjet
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It looks though SMIC has adopted the so-called "island hopping" tactic for its manufacturing processes: 28nm > 14nm > 7nm
14nm - 2018
7nm - 2020???
华为/ARM力挺！中芯国际加速自主7nm工艺：要做老大
2017-03-16 10:30:08 作者：万南
提起半导体先进制程，多数人首先想到的是Intel、台积电、三星、GlobalFoundries等，他们已经迈入10nm的节点，继续挑战摩尔定律。
而在内地，中芯国际（SMIC）则是规模最大、技术最先进的集成电路晶圆代工企业，目前已经可以成熟地代工28nm HKMG，量产14nm硅片凸块。
据Digitimes报道，中芯去年的营收同比增幅高达30.3%。
CEO表示，他们不仅将继续扩产12寸晶圆厂（300mm，目前业界最大最先进），还准备在7nm时代走上领导地位。
当然，问题就是，中芯国际的7nm何时能够推出。毕竟目前14nm仍未成熟，看起来他们和GF一样，准备跳过10nm这个过渡性的制程。
在资源储备上，中芯的研发投入占到营收的12%~13%的高度，7nm的合作伙伴已经有华为、欧洲微电子研究中心（IMEC）、中微半导体（AMEC）、ASML（阿斯麦）、Cadence（铿腾）、ARM、新思（Synopsys）、明导（Mentor Graphics）等众多大佬，外部也有国家对半导体的强力支持。
目前，7nm的EUV光刻机被ASML垄断，Intel和三星都用上了最先进的NXE 3350B，其单价高达6亿~15亿之间。
@Bussard Ramjet India?
Where's the 14nm you talk about? First it was supposed to happen by 2016.
cirr
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Exclusive: Chip wars – China closing in on second $19 billion semiconductor fund: sources
by The Editor | Apr 26, 2018
HONG KONG/SHANGHAI (Reuters) – China’s state-backed semiconductor fund is near to closing a 120 billion yuan ($18.98 billion)investment round for a second fund to support the domestic chip sector and help cut reliance on imports amid a bruising trade standoff with the United States.
FILE PHOTO: Employees work at a production line in the clean room of Semiconductor Manufacturing International Corporation (SMIC) in Shanghai February 25, 2008. REUTERS/ Nir Elias
The National Integrated Circuitry Investment Fund, also known as the “Big Fund”, is close to announcing the establishment of a new fund that will focus on boosting local chip production and technologies, according to three people with knowledge of the plans.
Reuters reported this month that Chinese officials were planning to accelerate the development of the domestic chip market, spooked by trade tensions and U.S. sanctions on ZTE Corp, a local telecoms equipment firm, that has underscored China’s heavy reliance on imported chips.
China’s industry ministry on Wednesday said the fund was raising its second investment round and that it welcomed foreign institutions to take part, without giving details.
The fund, which raised around $22 billion in its first outing, has been a target for U.S. politicians concerned that Chinese firms could challenge chip giants in the United States like Qualcomm Corp, a big supplier to Chinese firms.
China is still heavily reliant on imported chips, however, despite making the sector a priority under a push by President Xi Jinping to boost China’s own high-tech sectors, from robotics to electric cars.
That reliance became apparent after the United States slapped a 7-year ban this month on sales of products – including chips – to ZTE, which Washington said had violated an agreement reached after it was caught illegally shipping goods to Iran.
ZTE, which uses chips from Qualcomm in many of its phones, has said the ban could threaten its survival.
The second fund had been in the pipeline since before recent trade issues and the ZTE case, the people said, but added that Beijing now plans to invest more in the sector overall because of the rising trade tensions.
All three asked not to be named due to the sensitivity of the matter. The Ministry of Industry and Information Technology and the National Integrated Circuitry Investment Fund did not immediately respond to requests for comment.
CDB Capital Corp will be the main manager for both the first and second funds, and will invest in the new round, according to one of the people with direct knowledge. Potential investors in the second fund include local government-backed funds and state-owned enterprises, the person said.
Calls to CDB Capital, the investment arm of China Development Bank, went unanswered on Thursday. The firm did not immediately respond to emailed requests for comment.
A fourth person said the new fund would focus on three areas: memory chips, integrated circuit design and compound semiconductors such as silicon carbide and gallium nitride.
China is hoping to develop local chip technology following the blocking of several high-profile deals for foreign chip firms in the United States and Europe over national security concerns.
Some earlier estimates have said the second semiconductor fund would raise between 150-200 billion yuan. The sources said this was off the mark and that people were often prone to overestimating the size of the fund to “make it sound scary”.
The United States Trade Representative referenced China’s semiconductor roadmap, which includes national funding, in a report that authorized U.S. President Donald Trump to levy up to $100 billion in tariffs against China.
The Big Fund has previously invested in some 50 companies in the chip industry, including Hong Kong-listed Semiconductor Manufacturing International Corp and Yangtze Memory Technologies, a 3D NAND flash chip maker.
($1 = 6.3232 Chinese yuan renminbi)
Reporting by Julie Zhu and Kane Wu in HONG KONG and Cate Cadell in SHANGHAI; Writing by Adam Jourdan; Editing by Philip McClellan
http://www.toptechnicalsolutions.co...second-19-billion-semiconductor-fund-sources/
Let me repeat:
14nm - 2018
7nm - 2020
3nm - 2022
China has placed an order for ASML's EUV lithography currently scheduled for delivery in 2019.
Bussard Ramjet
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You said the same before, when you said that 14nm would be ready in 2016.
I have just heard the whole investor conference call of SMIC of the past quarter, and they don't talk anything about 14nm this year.
Also, placing an order for 2019 is actually indicative that things will take time, because you need equipment right from the stage of risk production. It takes time for the process to start mass volume production.
Anyways, let me find SMIC's latest technology plans, with the caveat of course, that they can miss it, as they have missed it back before.
TaiShang
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Code:https://www.eetimes.com/document.asp?doc_id=1333200
I see corporate China dominating the list.
Faraday Future:
chinese alternatives to finisar, lumentum, lclaro, neophotonics
these companies are making high performance 100G/200G and 400G optical transceivers for next-gen data centers
accelink
innolight - backed by google
hisense broadband - backed by huawei
eoptolink
o-net
hg genuine
these companies are making high performance 100G/200G and 400G optical transceivers for next-gen data centers
accelink
innolight - backed by google
hisense broadband - backed by huawei
eoptolink
o-net
hg genuine
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