SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore

[cirr]

Another chink in Qualcomm's armour？

Xiaomi and a bunch of other Chinese smartphone makers with low to mid-end devices are lining up to use this new SoC in their products。

SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore

SHANGHAI, Feb. 16, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), and Leadcore Technology Co. Ltd. ("Leadcore"), one of the core members of Datang Telecom Technology and Industry Group, jointly announce that SMIC's 28nm HKMG (High-K Metal Gate) process is ready with customer's NTO (New Tape Out) success. Based on this platform, Leadcore is launching a 28nm SoC (System on a Chip) for smartphones and other fields of applications, including high-performance application processor and mobile baseband functions. The chip has passed validation and is ready for mass production.

SMIC is the first foundry to provide both 28nm PolySiON and 28nm HKMG processes in Mainland China. Compared with the traditional PolySiON process, SMIC's 28nm HKMG process can provide improved drive capability and transistor performance and substantially reduce gate leakage. Based on SMIC's 28nm HKMG process platform, the Smartphone SoC launched by Leadcore has better performance, higher speed and lower power consumption, and CPU performance achieves 1.6GHz. To extend Leadcore's success in 4G mobile communication market, this launch will expand the market share of Smartphones which are equipped with chips made in China.

"We're glad to collaborate with Leadcore on 28nm HKMG process and develop advanced Smartphone SoC. Following the successful adoption by mainstream smartphones of the chips based on SMIC's 28nm PolySiON process, our 28nm HKMG process has also been highly recognized by end customers and is ready for commercial use," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC, "We will continue to develop and improve 28nm derivative technology platforms and expect to introduce an enhanced compact version of 28nm HKMG process at the end of 2016, and provide more optimized processes to customers."

Qian Guoliang, General Manager of Leadcore said, "Leadcore is dedicated to the R&D and application of the core technologies of 3G/4G mobile connectivity terminal and collaboration with ecosystem partners to create world-class products. This powerful industrial alliance with SMIC will promote domestic chip technology development and help Leadcore to improve the cost performance of our products to better serve the markets of Smartphone, smart car and robot and support 'Made in China 2025.' In the future, we will further strengthen our cooperation with SMIC and develop high-performance chip products based on more advanced technology nodes."

SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore -- SHANGHAI, Feb. 16, 2016 /PRNewswire/ --

 

[cirr]

SMIC, Leadcore Jointly Announce 28nm HKMG Process Ready to Launch

Published: Feb 17,2016

Dr. Zhou Zixue, Chairman of SMIC and Zhen Caiji, Datang Telecom Technology & Industry Group Board Chairman & President.

Semiconductor Manufacturing International Corporation ("SMIC"), and Leadcore Technology Co. Ltd. ("Leadcore"), jointly announce that SMIC's 28nm HKMG (High-K Metal Gate) process is ready with customer's NTO (New Tape Out) success.

Based on this platform, Leadcore is launching a 28nm SoC (System on a Chip) for smartphones and other fields of applications, including high-performance application processor and mobile baseband functions. The chip has passed validation and is ready for mass production.

SMIC is the first foundry to provide both 28nm PolySiON and 28nm HKMG processes in Mainland China. Compared with the traditional PolySiON process, SMIC's 28nm HKMG process can provide improved drive capability and transistor performance and substantially reduce gate leakage.

Based on SMIC's 28nm HKMG process platform, the Smartphone SoC launched by Leadcore has better performance, higher speed and lower power consumption, and CPU performance achieves 1.6GHz. To extend Leadcore's success in 4G mobile communication market, this launch will expand the market share of Smartphones which are equipped with chips made in China.

"We're glad to collaborate with Leadcore on 28nm HKMG process and develop advanced Smartphone SoC. Following the successful adoption by mainstream smartphones of the chips based on SMIC's 28nm PolySiON process, our 28nm HKMG process has also been highly recognized by end customers and is ready for commercial use," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC,

"We will continue to develop and improve 28nm derivative technology platforms and expect to introduce an enhanced compact version of 28nm HKMG process at the end of 2016, and provide more optimized processes to customers."

Qian Guoliang, General Manager of Leadcore said, "Leadcore is dedicated to the R&D and application of the core technologies of 3G/4G mobile connectivity terminal and collaboration with ecosystem partners to create world-class products. This powerful industrial alliance with SMIC will promote domestic chip technology development and help Leadcore to improve the cost performance of our products to better serve the markets of Smartphone, smart car and robot and support 'Made in China 2025.' In the future, we will further strengthen our cooperation with SMIC and develop high-performance chip products based on more advanced technology nodes."

CTIMES News - SMIC, Leadcore Jointly Announce 28nm HKMG Process Ready to Launch

 

[cirr]

Fri Feb 19, 2016 7:05am EST

China's Xiaomi to use smartphone chips designed in-house - source

HONG KONG | BY YIMOU LEE

People stand near a logo of Xiaomi ahead of the launching ceremony of Xiaomi Phone 4, in Beijing in this July 22, 2014 file picture.

REUTERS/JASON LEE/FILES

China's most valuable start-up Xiaomi Inc [XTC.UL] is aiming to use smartphone processor chips designed in-house in some of its lower-priced handsets in the second half of this year, a source with direct knowledge of the matter told Reuters.

The move would mark the first time that Xiaomi has used chips designed in-house, something analysts have said could put pressure on industry leaders such as Qualcomm Inc (QCOM.O) and MediaTek Inc (2454.TW), which supply the company.

The in-house smartphone application processor chips are designed for Xiaomi's mid- to low-priced smartphone model RedMi Note series, but it is unclear how many Xiaomi is planning to make this year, said the source, who declined to be named because the information is not public.

The move comes as Beijing ploughs billions of dollars into home-grown chip companies in a bid to end China's reliance on foreign semiconductors.

The world's fifth-largest smartphone vendor, Xiaomi has hired 200 to 300 people to work on smartphone chip design in cities including Nanjing, Shanghai and Beijing, the source said.

"Xiaomi is copying the model of designing processor chips in-house from Apple Inc (AAPL.O), Samsung Electronics Co Ltd (005930.KS) and Huawei Technologies Co Ltd [HWT.UL]," the source said, referring to the only three vendors who have the ability to put self-designed smartphone processor chips into commercial use at the moment.

Beijing-based Xiaomi declined to comment when contacted by Reuters on Friday.

LONGSTANDING AMBITION

Xiaomi has long been keen on making in-house chips.

Chinese chip designer Leadcore Technology Ltd, a subsidiary of state-backed Datang Telecom (600198.SS), in 2014 signed an agreement with privately-owned Beijing Pinecone Electronics to jointly design 4G multiple mode chips, a stock exchange filing showed.

Beijing Pinecone Electronics is controlled by Xiaomi, the source and industry analysts told Reuters. Xiaomi declined to comment on its ties with the company.

Analysts said Chinese smartphone vendors' ambitions to design smartphone chips have become one of their major strategies to maintain market share and margins amid intense competition.

MediaTek was likely to come under pressure as it supplied most of Xiaomi's mid- to low-priced smartphone chips, analysts said. MediaTek shipped about 20 million processor chips to Xiaomi last year, according to a report by Jefferies.

"Designing chips in-house actually costs more if the scale of smartphone vendors is not enough to support the cost of R&D," Taiwan-based MediaTek said. "In the end, they still have to outsource that to professional chip suppliers."

Qualcomm did not immediately respond to a request for comment.

China's Xiaomi to use smartphone chips designed in-house - source | Reuters

 

[cirr]

US$2.1 bln of annual capex is still way too low。US$10 bln is more like it。

Hungry for growth, China’s top chipmaker SMIC budgets US$2.1 bln for foundry operations after record 2015

Shanghai-based chipmaker moving to raise capacity at three of its six fabrication plants - or fabs - on the mainland

PUBLISHED : Friday, 19 February, 2016, 7:32pm
UPDATED : Friday, 19 February, 2016, 7:32pm

Bien Perez


Chiu Tzu-yin,CEO of Semiconductor Manufacturing International Corporation, is pictured at an office in Hong Kong’s Central district in this file photo. Photo: Paul Yeung

Semiconductor Manufacturing International Corp (SMIC), China’s largest contract chipmaker, plans to significantly raise its production capacity this year to meet strong market demand, after posting record-high net profit and revenue last year.

The Shanghai-based company has budgeted about US$2.1 billion in capital expenditure for its foundry operations, up from US$1.4 billion last year, to ratchet up the capabilities at three of its six fabrication plants, or fabs, on the mainland.

“By the end of this year, we [aim] to increase our Shenzhen fab capacity to approximately 30,000 8-inch wafers per month, our Beijing joint-venture fab to 15,000 12-inch wafers per month, and our Shanghai 12-inch fab to 20,000 wafers per month,” SMIC chief executive Chiu Tzu-yin said in a conference call with analysts on Friday.

“We are optimistic about 2016 given our strategy and execution track record.”


SMIC’s headquarters in Shanghai. The company has fab plants in a number of Chinese cities including Beijing, Shanghai and Shenzhen. Photo: Handout

Listed in both Hong Kong and New York, SMIC reported a 36 per cent jump in fourth-quarter net profit to a record US$38.6 million, up from US$28.4 million in the same period one year earlier. This was largely driven by more wafer shipments.

Total revenue last quarter grew 25.6 per cent to a new high of US$610.1 million, compared with US$485.9 million a year earlier.

Jefferies equity analyst Ken Hui pointed out that Sweden-based sensor supplier Fingerprint Cards remained a solid growth driver for the contract chipmaker.

“SMIC saw revenue from [geographic market] Eurasia grow 32 per cent quarter-on-quarter,” Hui said.

Communications applications were the biggest market segment SMIC made chips for in the last quarter, followed by consumer applications.

“Despite the inventory correction in the industry during the year, we maintained full [fab] utilisation

throughout 2015,” Chiu said.

That resulted in a 65.7 per cent rise in net profit last year to US$253 million, up from US$153 million in 2014.


SMIC saw total revenue last quarter grow 25.6 per cent to a new high of US$610.1 million. Photo: Bloomberg

Revenue rose 13.5 per cent to reach a new high of US$2.2 billion in 2015, compared with the 2014 total of US$1.9 billion.

“With the large opportunities presented to us being in China, we strive to capture the attractive

prospects with profitability as our underlying objective,” Chiu said.

The customers of SMIC consist of fabless semiconductor companies, which design chips and outsource fabrication to integrated-circuit foundries.

Texas Instruments and Qualcomm, which supply many of the essential chips used in smartphones and media tablets, are among SMIC’s top multinational clients.

“To address many of the opportunities at hand, SMIC plans to grow through both organic and inorganic means,” Chiu said.

Jefferies’ Hui said SMIC may be eyeing acquiring overseas assets to accelerate capacity addition for its 8-inch wafer production.

Backed by a government policy that is infusing vast amounts of capital into the domestic market to spur consolidation, SMIC and other local players are expected to continue driving mergers and acquisitions in the global semiconductor industry.

According to Bernstein analysts, the domestic market is big enough for SMIC to continue expanding because supply from Chinese fabless chip companies currently only meets 10 per cent of the country’s total annual demand.

Despite the record-high earnings results for last year, SMIC’s Hong Kong shares fell 2.94 per cent to close the week at 66 cents.

Hungry for growth, China’s top chipmaker SMIC budgets US$2.1 bln for foundry operations after record 2015 | South China Morning Post

 

[Skull and Bones]

Chinese mid to lower end phones has been using Mediatek processors for a long time, I don't think that market concerns Quancomm much.

 

[cirr]

Chinese mid to lower end phones has been using Mediatek processors for a long time, I don't think that market concerns Quancomm much.

Parts of Qualcomm‘s 4xx and 6xx processors will be replaced by this new SoC。

 

[Skull and Bones]

Parts of Qualcomm‘s 4xx and 6xx processors will be replaced by this new SoC。

400 and 600 series of processors are crap anyways.

 

[cirr]

Xiaomi’s fledgling IP portfolio gets biggest boost yet with acquisition of several hundred Intel patents

22 FEB 16

Jack Ellis

Xiaomi has acquired a significant portfolio of patents from Intel in what looks to be the Chinese company’s most significant IP acquisition to date.

In an assignment dated to 4th February and recorded with the US Patent and Trademark Office four days later, the California-based semiconductor giant transferred ownership of 332 US patents to an entity named Beijing Xiaomi Mobile Software Co, Ltd, which shares an address with Xiaomi’s corporate headquarters in Beijing.

The portfolio appears to cover a broad range of telecommunications, electronics and software-related technologies. Most of the transferred patents were originally assigned to Intel; a fair few had initially been owned by fellow US chipmaker LSI. In August 2014, Intel purchasedLSI’s former networking business from Avago, which had earlier acquired LSI in a $6.6 billion deal.

Coincidentally, Broadcom – as Avago is now known following a $37 billion merger last year – has transferred a number of patents to Xiaomi in recent months. Those deals were the first known examples of the Chinese company obtaining third-party patents in what looked to be the beginning of a long-anticipated and long-promised drive to beef-up its IP position. However, in terms of the quantity of acquired assets alone, the Intel transaction would seem to be even more strategically significant.

Intel’s assignment of patents to Xiaomi follows rumours that the two companies had struck a deal over the supply of microprocessors – an issue that has proved to be of particular concern to the Beijing-based start-up. According to anonymous sources reported by DigiTimes, Intel has offered to give away one of its Atom processors – which power Xiaomi’s Tablet 2 – with every one of its new Core chips that the Chinese company buys for its upcoming range of notebook computers. To put it another way, Intel is throwing in a freebie to retain Xiaomi as a customer and ensure that its technology is present in some of the Asia-Pacific’s best-selling consumer electronics products.

As IAM’s readers will know, something else that Xiaomi is in desperate need of – apart from affordable, high-quality microchips – is patents. It may well be the case that Intel agreed to throw in a sizeable portfolio of patents to sweeten the deal and to get Xiaomi signed on the dotted line. Intel is far from being short on patents;research from MDB Capital Group published in issue 71 of IAM revealed the Californian company to own 24,306 US-issued patents, giving it the seventh-largest portfolio of in-force US assets. Intel is also building a strong showing in Chinese patents, having been the sixth most prolific non-resident filer of applications at the country’s State IP Office last year.

Intel has been particularly active among US companies in trying to penetrate China’s semiconductor-related markets. In early 2014, it entered into a strategic partnership with Chinese fabless outfit Rockchip; later that year, it invested $1.5 billion to take a significant stake – alongside Chinese state-backed vehicle Tsinghua Unigroup – in the holding company that owns domestic chipmakers Spreadtrum and RDA.

Xiaomi’s fledgling IP portfolio gets biggest boost yet with acquisition of several hundred Intel patents - Blog - Intellectual Asset Management (IAM) - Maximising IP Value for Business

 

[cirr]

Spreadtrum Announces its First 16nm 5-Mode Octa-Core LTE SoC PlatformLTE Smart Phones Adopting SC9860 Platform Target Medium & Premium 4G Markets Globally

BARCELONA, Spain, Feb. 22, 2016 /PRNewswire/ -- Spreadtrum Communications ("Spreadtrum"), a leading fabless semiconductor provider in China with advanced technology in 2G, 3G and 4G wireless communications standards, today announced its 64-bit Octa-Core LTE SoC platform, SC9860 chipset at mass production stage in 2016 Mobile World Congress (MWC) , Barcelona. As Spreadtrum's single chip solution for medium and premium smart phones, SC9860 possesses excellent computing ability and features premium multi-media applications, which bring about ultimate user experience for global handset consumers.

SC9860 adopts advanced TSMC 16nm FFC process, which provides better power efficiency than that of the 20nm and 28nm products. It employs an ARM 64-bit, >2.0GHz, Octa-Core Cortex-A53 processor with the highest power efficiency and is embedded with cutting-edge Mali T880 MP4 GPU which supports high fidelity content for 4K and beyond, and boosts a powerful graphics performance. At the same time, SC9860 equips three ISPs to support up to 26Mp camera, dual camera and real-time rear/front camera capture/record. By which it supports real 3D capture. It integrates HEVC hardware support for Ultra HD 4K2K video record and playback, WQXGA (2560 x 1600) display. Moreover, the embedded SensorHub provides a complete user sensing and sensor fusion solution. With these high performance, high efficiency and high integration solution, SC9860 creates an ultimate user experience.

SC9860 supports two-way carrier aggregation and hybrid TDD/FDD network with LTE CAT7 modem. It enables peak target data transmission rate to 300 Mbps above in downlink and 100 Mbps in the uplink.

"SC9860 is Spreadtrum's first step forward to 4G SoC single chip, targeting medium and premium smart phone chip markets. This chipset demonstrates our significant technology breakthrough." said Dr. Leo Li, Chairman and CEO of Spreadtrum Communications. "Backed by TSMC's advanced technology and strategic support, we were an early adopter of its 16nm FFC process for our commercial cellular baseband product. The successful release of SC9860 proves Spreadtrum as an all-round player and underscores our leading position in global smart phone chip market. And Spreadtrum is on the way to continuously strengthening the R&D capabilities in handset chip design. This time, Spreadtrum SC9860 positions for medium and premium 4G smart phone markets. In the future, by collaborating with our customers and partners, we will design more innovative products with higher performance and smoother user experience."

President and Co-CEO of TSMC Dr. C.C. Wei comments, "Spreadtrum is a leading company in cellular baseband semiconductor. We are impressed with its phenomenal growth in recent years and are happy to have been Spreadtrum's partner since its inception. We are pleased to see Spreadtrum's high-end device SC9860 delivers excellent performance by employing TSMC's new 16nm FFC technology, which provides outstanding power efficiency and cost effectiveness for our customers. "

SC9860 has entered mass production stage. The LTE smart phone with this SoC platform is expected to launch in the second quarter of this year.

Spreadtrum Announces its First 16nm 5-Mode Octa-Core LTE SoC Platform -- BARCELONA, Spain, Feb. 22, 2016 /PRNewswire/ --

 

[cirr]

Huawei MateBook: Chinese Company Takes On Apple And Microsoft With Surface And iPad Pro Rival

BY DAVID GILBERT @DAITHAIGILBERT

ON 02/21/16 AT 9:55 AM

Huawei has dipped its toe into the personal-computer market for the first time with a tablet-laptop hybrid called the MateBook.PHOTO: HUAWEI TECHNOLOGY CO. LTD.


BARCELONA, Spain — Huawei Technology Co. Ltd. is a company on the rise. In 2015, it outpaced Apple Inc., Samsung Electronics Co. Ltd. and pretty much every other smartphone maker with huge growth, propelling it to a third-place finish in the market. Now it is looking to build on that success by launching its first personal computer, the MateBook, which is a direct rival of Apple’s iPad Pro and Microsoft Corp.’s Surface.

The MateBook is a 12-inch tablet that comes with a convertible keyboard cover and stylus, very similar to the Microsoft Surface, which has defined the convertible market for the last few years. Huawei claimed the MateBook is the lightest 12-inch tablet on the market, and it measures just 6.9 millimeters (0.27-inch) thick.

While the MateBook’s display has decent resolution at 2160x1440, it lags both the iPad Pro (2732x2048) and the Surface Pro 4 (2736x1824). Huawei said the device’s battery life is nine hours and that it is powered by Intel Corp.’s power-efficient Core M chipset.

“With this landmark device, Huawei is demonstrating our industry-leading design and manufacturing expertise by bringing a beautifully crafted flagship product to market that is redefining the new style of business — connected computing across all devices in almost every scenario,” said Richard Yu, CEO of the Huawei consumer business group.

The Huawei MateBook will look to take on the iPad Pro and the Surface Pro 4.PHOTO: HUAWEI TECHNOLOGY CO. LTD.

While the MateBook may be a “landmark” device for Huawei, it is entering an increasingly competitive marketplace where it has little experience and where it will be going up against the likes of Dell Inc., HP Inc. and its Chinese compatriot Lenovo Group Ltd. — the world’s biggest computer maker — as well as dozens of other companies that are all struggling to stay afloat in a PC market that has been in decline for years.

Huawei said the MateBook will be coming to the U.S., but the company so far has revealed only European pricing for the new PC, with the base model (4 gigabytes of RAM, 128GB of storage) costing 799 euros ($890). A comparable Surface Pro 4 costs 999 pounds ($1,439), but unlike the case with the MateBook this amount does not include the keyboard cover. Apple’s iPad Pro is priced at $949 for the 128GB model, but again a purchaser would have to pay more for the keyboard cover and the stylus.

Huawei MateBook: Chinese Company Takes On Apple And Microsoft With Surface And iPad Pro Rival

 

[senheiser]

Chinese mid to lower end phones has been using Mediatek processors for a long time, I don't think that market concerns Quancomm much.

everything uses Mediatek now for a while

 

[Skull and Bones]

everything uses Mediatek now for a while

My phone use Snapdragon 808, my previous one used some 6xx series.

 

[senheiser]

My phone use Snapdragon 808, my previous one used some 6xx series.

Mediatek is better than Quallcom by the way

@TaiShang

 

[TaiShang]

Mediatek is better than Quallcom by the way

@TaiShang

Passed many times in front of their TP HQs, LOL.

***

MediaTek Introduces Helio P20 as Newest Addition to its Premium Mobile Processor Family
New ultra-power saving SoC for slim smartphones also delivers new multimedia features

Monday, February 22, 2016

SPAIN, Barcelona – February 22, 2016 – MediaTek today announced the MediaTek Helio P20 system-on-chip, an ultra-power saving SoC and the latest addition to its top-tier MediaTek Helio family of mobile processors. The MediaTek Helio P20 brings new experiences to consumers and design freedom to device makers by combining impressive battery life, powerful performance and premium features for the next generation of smartphones.

Following on the breakthrough success of the MediaTek Helio P10, the MediaTek Helio P20 offers 25 percent better power efficiency. The P20 chipset is manufactured using 16nm process technology, and is the world’s first SoC to support low power double data rate random access memory – LPDDR4X. In performance improvements, the SoC features upgraded CPU and GPU capabilities with its True Octa-Core architecture clocked up to 2.3GHz, taking full advantage of ARM Cortex A53 cores. The new Mali T880 graphics unit is clocked at a speedy 900MHz, perfect for demanding video and gaming apps, and is currently the highest end GPU offered by ARM.

“MediaTek designed the MediaTek Helio P20 to meet today’s consumer demand for sleek, powerful yet highly power efficient mobile devices,” said Jeffrey Ju, Executive Vice President and Co-Chief Operating Officer at MediaTek. “Consumers place increasing importance on the battery life and multimedia capabilities of their smartphones. MediaTek has risen to this challenge with a leading solution.”

MediaTek Helio P20 has several connectivity advantages. It is equipped with MediaTek’s latest modem technology supporting WorldMode LTE Cat.6 and 2x20 carrier aggregation at 300/50Mbps data speeds. The SoC supports global Dual-SIM Dual Standby for seamless connectivity wherever a user goes. For regions where GSM is no longer available, the SoC will have simultaneous standby on WCDMA network. Additionally, MediaTek Helio P20 supports LTE multimedia broadcast and multicast service. This allows mobile devices to receive HD video content over LTE.

For improved processing power and optimum battery performance, MediaTek Helio P20 integrates LPDDR4X, providing 70 percent more bandwidth than the LPDDR3 and 50 percent power savings by lowering supply voltage to 0.6v, resulting in a quicker, smoother user experience for camera, video and gaming apps.

Another P20 highlight is the exclusive MediaTek Imagiq Image Signal Processor (ISP), which leverages the same design from MediaTek Helio X20, to improve camera ease-of-use and picture and video quality. MediaTek Imagiq encompasses the latest ISP technologies to satisfy the most demanding smartphone photographers with features that include:

• Advanced 12bit Dual ISP supports Bayer and Mono sensors – elevates picture quality by effectively reducing noise and capturing three times more light than conventional Bayer + Bayer sensors
  
  
• Dual phase-detection autofocus – achieves real-time auto focus that is four times faster than traditional autofocus systems
  
  
• 3A HW engine upgrades for more natural, responsive and detailed photographs
  
  
• Powerful multi-scale temporal de-noising technologies – renders videos and photography more accurately, with less noise, even in low light
  

The MediaTek Helio P20 is expected to be in commercial devices in the second half of 2016. More information can be found at http://mediatek-Helio.com/p20/