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Opinionated - China Chipping Away to Semiconductor Dominance

By David Manners 8th December 2017

China IC design industry tops $30bn

China’s IC design industry revenue will reach $30 billion in 2017, says Trendforce, and a growth rate of 20% is expected to deliver $36 billion industry revenue in 2018.



HiSilicon and Sanechips (ZTE Microelectronics) provide NB-IoT chipS, Cambricon Technologies and Horizon Robotics are developing AI chips. Unigroup Spreadtrum RDA, Datang, and HiSilicon have made chips for 5G.

Datang Semiconductor drops out of Trendforce!/ China top ten, with WillSemi and GigaDevice entering the list.

HiSilicon grew revenues more than 25% due to the increasing penetration rate of Kirin chips in phones.

Tsinghua Unigroup Subsidiaries Spreadtrum and RDA had a drop in revenue because of competition in the low- and mid-range mobile IC market.

Sanechips, whose core business is designing IC components for telecommunication applications, has grown revenues over 30%.

Huada Semiconductor makes ICs for smart cards, security ICs, analogue ICs circuit, and display drivers etc. Its 2017 revenue is expected to top $755 million.

Goodix had revenue growth of 25% as a result the increasing penetration rate of fingerprint recognition technology in smartphones.

GigaDevice, which enters the top 10 list for the first time, makes NOR Flash and 32bit MCUs. Its 2017 revenue is expected to increase by more than 40%, reaching $300 million.

https://www.electronicsweekly.com/news/business/china-ic-design-industry-tops-30bn-2017-12/

@Bussard Ramjet HiSilicon is now a 5.86 billion USD fabless business. 10 billion by 2020? :D
 
大国重器 芯片高端装备迈向新征程

——中电科电子装备集团有限公司砥砺攻关国家02专项纪实

孙友芳

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28nm离子注入机在中芯国际12英寸生产线现场

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200mmCMP设备进入中芯国际生产线进行工艺验证

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PERC高效光伏电池智能制造生产线核心智能装备国产化率达91.8%

日前,中电科电子装备集团有限公司(以下简称电科装备)传来好消息,自主研发的国内首台中束流离子注入机在中芯国际大生产线上稳定流片逾200万,首台200mmCMP设备实现了销售。这是电科装备承担“极大规模集成电路制造装备及成套工艺”科技重大专项(以下简称02专项)所取得重大成果的缩影。

9年间,电科装备共承担了02专项“90—65nm大角度离子注入机研发及产业化”“封装设备关键部件与核心技术”“45—22nm低能大束流离子注入机研发及产业化”“28—14nm抛光设备及成套工艺、材料产业化”“300mm超薄晶圆减薄抛光一体机研发与产业化”等项目。

9年来,在02专项的支持下,电科装备先后突破了离子注入机、化学机械抛光设备(CMP)等若干攻关难度大、带动力强的集成电路关键装备核心技术;取得了发明专利授权146项,获得了省部级以上奖励22项;建成了符合SEMI标准的离子注入机批量制造平台、设立博士后科研工作站;CMP研发平台获批“北京市化学机械平坦化工艺设备工程技术研究中心”;国产首台离子注入机、200mmCMP设备进入中芯国际大生产线,先进封装设备具备集成服务能力,进入国内先进封装龙头企业……

千锤百炼 抒写国芯基石的责任与担当

集成电路芯片是信息时代的核心基石,集成电路制造技术代表着当今世界超精密制造的最高水平,集成电路产业已成为影响社会、经济和国防的安全保障与综合竞争力的战略性产业。

然而,由于集成电路产业资金密集型、技术密集型、人才密集型的特点,长期以来,我国集成电路产业一直受到西方在先进制造装备、材料和工艺等方面的种种制约,高端芯片主要依赖进口。我国集成电路产品连续多年每年进口额超过2000亿美元,超过石油成为最大宗进口产品。

为实现自主创新发展,2008年国家启动02专项,主攻装备、工艺和材料的自主创新。

北京市经信委主任张伯旭表示,高端装备和材料从无到有填补产业链空白,制造工艺与封装集成由弱渐强走向世界参与国际竞争,表明国家科技重大专项打造集成电路制造创新体系的阶段性目标已经实现。在近几年我国集成电路产业的蓬勃发展中,重大专项发挥了显著的创新引领和技术支撑作用。

在02专项的高端装备攻关中,电科装备发挥了举足轻重的作用。

电科装备是中国电子科技集团公司(以下简称中国电科)的全资子公司,成立于2013年,由中国电科二所、四十五所和四十八所及其11家控股公司整合而成,地跨北京、太原、长沙、上海等六省市八园区。

成立以来,电科装备高举电子制造装备国家队的旗帜,发扬能吃苦、讲奉献、肯坚守的“十年磨一剑”装备精神,按照“重点突破、平台支撑、局部成套、集成服务”的发展思路,坚持创新发展,坚持军民融合,坚持装备报国,攻克了集成电路制造关键装备离子注入机、化学机械抛光设备等关键技术,解决了一批制约我国军工电子元器件自主可控发展的“卡脖子”问题,支撑了半导体和新兴电子元器件产业的快速发展,抒写了大国重器的责任与担当。

依托多年集成电路核心装备领域技术积累和军工科研生产技术的底蕴,电科装备形成了高端显示、光伏新能源、动力电池材料等泛半导体装备局部成套和集成服务能力,大幅提升装备国产化率。目前是国内主要集成电路装备、最大的高端显示装备、光伏制造装备、动力电池材料制造装备供应商,具备集成电路局部成套和系统集成能力,具备完整的光伏产业链和整线交钥匙能力。

打破垄断 锻造出离子注入机国产品牌

突破关键技术,取得发明专利101项,国际专利2项,已实现系列化产品并用于中芯国际90nm、55nm、40nm、28nm工艺生产线……这是电科装备承担02专项两个离子注入机研发项目所取得的部分成果。

离子注入机是集成电路制造至关重要的核心装备——主要是将粒子注入到半导体材料中,从而控制半导体材料的导电性能,进而形成PN结等集成电路器件的基本单元。

作为国内唯一一家集研发、制造、服务于一体的离子注入机供应商,电科装备在承担了02专项后,在离子注入机研发方面,一年迈上一个新台阶。

2014年,12英寸中束流离子注入机以优秀等级通过国家02专项实施管理办公室组织的验收。2015年,在中芯国际先后完成了55nm、45nm和40nm小批量产品工艺验证,国产首台中束流离子注入机率先实现了量产晶圆过百万片。2016年,推出满足高端工艺的新机型45—22nm低能大束流离子注入机,中束流、低能大束流系列产品批量应用于IC大线。2017年,离子注入机批量制造条件厂房及工艺实验室投入使用,具备符合SEMI标准的产业化平台,年产能达50台,并应用信息化管理系统实现离子注入机批量制造全程质量控制及追溯。

“积厚成器,对于装备制造业来说,不仅要关注单台设备的开发,在一定范围内成套供应,形成平台化的生产能力更加重要。”董事长、党委书记刘济东强调,电科装备自主研发的离子注入机打破了高端市场被美日垄断的局面,打造了离子注入机国产品牌。

零的突破 国产200mmCMP进入中芯产线验证

11月21日,电科装备自主研发的200mmCMP商用机完成内部测试,发往中芯国际天津公司进行上线验证。这是国产200mmCMP设备首次进入集成电路大生产线,有效解决了制约我国集成电路产业自主可控发展的瓶颈问题。

CMP是集成电路制造七大关键设备之一,用于平坦化工艺及铜互联工艺。

电科装备迎难而上,两端发力。在承担“十二五”02专项“28—14nm抛光设备及成套工艺、材料产业化”项目的同时,面向国内市场的紧迫需求,自主投入研制200mmCMP商用设备,形成300mm、200mm设备研发齐头并进、相互支撑的局面。

从2015年1月开始,电科装备CMP设备研发团队用无数的不眠之夜,终浇灌出CMP设备产业化之花:突破了10余项关键技术,完成了技术改进50余项,终于在2017年8月成功研发出了国内首台拥有完全自主知识产权的200mmCMP商用机,成功打破国外技术封锁垄断。经严格的万片“马拉松”测试,该设备目前可媲美国际同类设备。

据悉,在接下来的6个月里,200mm CMP设备要正式接受大生产的考验,设备的可靠性和一致性将经受严格考核。

成套供应 先进封装关键设备批量应用于龙头企业

封装设备累计销售2000余台套,已经批量应用于长电科技、通富微电、苏州晶方等国内知名封测企业——在高端封装设备领域,电科装备已经形成局部成套的供应能力。

“十一五”以来,在02专项的支持下,电科装备先后承担了300mm超薄晶圆减薄抛光一体机以及封装设备关键部件与核心技术等技术和产品开发项目。

如今,电科装备研发的倒装芯片键合机、自动晶圆减薄机、全自动精密划片机达到国内领先、国际先进水平;并以自主研发的设备建设了集成电路先进封装设备局部工艺验证线,为持续提升国产集成电路封装设备的稳定性和可靠性提供良好的平台。

“在设备开发的时候就需要以工艺需求为导向展开设备设计和制造,并且不断地进行工艺验证。”刘济东说。

目前,封装设备工艺验证线具备三大功效:一是验证设备、验证工艺,将减薄、划切、倒装、引线键合等设备在验证线上进行稳定性、可靠性、工艺适应性的考核验证;二是验证设备批量化生产,提升设备批量交付的能力;三是强化局部成线的能力,为提供整体解决方案积累经验。

责任呼唤担当,使命引领未来。

电科装备作为电子制造装备领域的国家队,将秉承装备报国的重任,打造电子高端装备“大国重器”,铸就国芯基石。未来,围绕攻克集成电路制造核心装备关键技术,电科装备将坚持科技创新和产业投入双轮驱动,持续发力。围绕装备和装备产业支撑下的相关产业,着力提升产业化水平,通过内整外联、聚集资源,建设北京集成电路装备创新中心和产业化基地、中国电科(山西)电子信息科技创新产业园和长沙光伏装备产业园,服务国家和地方发展;同时,培育智能制造电子细分行业标准制定、智能装备制造和智能制造系统解决方案的能力,成为国内主流的智能制造骨干企业、智能制造系统解决方案供应商之一。

http://digitalpaper.stdaily.com/http_www.kjrb.com/kjrb/html/2017-12/18/content_384262.htm?div=0

@Bussard Ramjet :coffee::D
 
BOE lights up world’s first Gen-10.5 LCD line
By Chu Daye in Hefei Source:Global Times Published: 2017/12/20 22:13:39

Plant will allow Chinese players to break S.Korean monopoly

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People check out BOE's products at an exhibition in Wuhan, Central China's Hubei Province in November. Photo: VCG

Leading Chinese semiconductor display panel producer BOE Technology on Wednesday began production at the world's first Generation-10.5 thin-film transistor liquid crystal display (LCD) panel fabrication plant, intensifying competition among makers of the world's largest TV panels.

The company said the official operation of the fabrication facility in Hefei, capital of East China's Anhui Province, will usher in a new era of ultra-high-definition 8K display technology.

The Hefei plant, which is the world's highest generation facility, will be able to process glass substrates that reach 3,370 by 2,940 millimeters, in contrast to the 2,500 by 2,200 millimeters glass substrates now processed by mainstream Generation-8.5 fabrication plants. This change represents an 80 percent increase in area of the processed substrates.

The plant allows larger substrates to be processed more economically and it enables BOE to make forays into the production of large panels of above 55 inches, a market segment largely dominated by South Korean companies.

Zhang Yu, senior vice president of BOE, told the Global Times on Wednesday that begin production means that Chinese firms have become the leaders in the race to produce large-sized display panels.

"Chinese producers are now in the position of front-runner, ahead of their South Korean and Japanese rivals," Zhang said.

Being the world's first gives BOE many opportunities, like developing and influencing technical standards, Zhang said on the sidelines of the event.

Li Yaqin, deputy general manager at industry portal sigmaintell.com, said the commencement of the BOE Hefei fabrication facility is the starting point of a new era, in which Chinese players will take on the advantageous position currently held by South Korean companies such as LG Display and Samsung.

"By 2019, the scale of Chinese companies' panel production capacity from plants of Generation-6 and above will become No.1 in the world. By 2020, the production capacity of BOE in this segment will surpass that of LG Display to top the world," Li told the Global Times on Wednesday.

In 2017, Chinese mainland-based makers of large LCDs (more than 55 inches) only held a 2 percent global market share, while makers from South Korea and the island of Taiwan had a combined 98 percent share, according to data from signaintell.com.

According to estimates by simgaintell, China's large panel output will increase from the current 2 percent market share to 12 percent next year, boosted by the output from BOE.

"Lack of capacity to produce large-sized panels has constrained the development of Chinese players, and the operation of this line can fill that gap. However, it will take time for the facility to achieve its designed output," Li said, noting that high scrap rates occur during the production process of such large and advanced panels.

"It's a good starting point to break the monopoly of rival companies and realize innovation at the world's highest-generation production facility," Li said, noting that display panels are increasingly growing in size and boasting ever-higher definition. These trends pose a growing challenge to production capacity.

South Korea, which has kept the top position in the global LCD market for nearly a decade in terms of production, appears about to be overtaken by China, Seoul-based Aju Business Daily reported in September.

In 2018, China will produce 35.7 percent of the world's large LCD panels to stand No.1 for the first time in history, followed by the island of Taiwan's 29.8 percent and South Korea's 28.8 percent, the report said, citing market research firm Witzview.

China's large LCD panel production capacity is projected to reach 48.3 percent of the global total in 2020, according to the report.

However, Li said although Chinese panel makers will enjoy world's leading position in production capacity, there are still considerable gaps with makers from South Korea and the island of Taiwan in terms of industrial structure, overall strength and technological innovation.

By 2022, the competition among BOE, LG Display and Taiwan-based Hon Hai Precision Industry Co will still be closely matched, Li said.

While it took years for rivals to bring scrap rates into a reasonable range,

Zhang told the Global Times that BOE plans to achieve reasonable scrap rates at the Hefei plant before July 2018.

In terms of innovation, the shift from 4K display technology to 8K technology could be a turning point for Chinese players to further narrow the gap, Li said.
 
Domestic tech firms step up efforts on chip production

2018-01-12 13:09

China Daily Editor: Liang Meichen

In response to the country's increasing stress on internet and information security, domestic companies have sped up their research and development of independently produced and controllable chips.

Shanghai Zhaoxin Semiconductor Co Ltd released its independently developed and produced general-purpose central processing unit KX-5000 at the end of December 2017. It is the first domestically produced CPU supporting dual-channel DDR 4 memory, which has been widely adopted by the world's leading manufacturers such as Intel and ADM for their new products this year.

The company says the KX-5000 series octuple-core processor has a similar performance to that of Intel's Core i3-6100 processor.

Founded in 2013, Zhaoxin began mass production in 2016. Last year, as many as 30,000 Zhaoxin chips were sold and the goal for 2018 is a maximum 200,000 chips. At present, local government departments and a number of domestic companies in Shanghai have purchased computers installed with Zhaoxin chips. The large office computer market in China is the long-term target for Zhaoxin, according to the company's Chairman Ye Jun.

Zhaoxin is the first and only Chinese company that has grasped the three key technologies in chip production-CPU, graphics processing unit and chipset.

Ye said such technologies are of great importance in terms of China's information security and industrial security. It is especially imminent since the industry leader Intel has been reported at the beginning of this year to have two major bugs that might allow sensitive data such as passwords to be stolen, he said.

Ye also stressed that less reliance on imported chips will secure the production of Chinese manufacturing companies. Shenzhen-based telecom company ZTE halted trading in early March last year because the central government of the United States banned it from importing US chips. Consequently, its production was dramatically affected.

According to Wei Shaojun, professor of Institute of Microelectronics at Tsinghua University, the value of imported integrated circuit products hit a record high in China last year to reach $250 billion. Integrated circuits have become the product with the highest import value in the country, overtaking crude oil. Among the $250 billion, the majority has been spent on CPUs.

Meanwhile, the world's CPU market has been dominated by the two US giants-Intel and AMD-with Intel taking up the majority 86 percent and AMD accounting for 13 percent, according to market consultancy Mercury Research.

"Our goal is to become the world's third-largest CPU manufacturer," Ye said. "We have already made the first moves, which is like making the first crack on an iron plate."

http://www.ecns.cn/business/2018/01-12/288167.shtml
 

Qualcomm is the most caste ridden tech, whereby hiring is skewed in favor of South Asian. A year ago when I looked at Qualcomm numbers, I predicted it to be surpass by MTK in 5 years.

The purchase of NXP manage to buy her sometime.
 
China's silicon valley reports revenue growth in first 11 months
Xinhua, January 14, 2018

The high and new-tech firms in Beijing's Zhongguancun Science Park reported increased revenue in the first 11 months of 2017, official data showed.

The technology park made 4.2 trillion yuan (about 650 billion U.S. dollars) during the period, up 14.2 percent year on year, according to the Beijing Municipal Bureau of Statistics.

Advanced manufacturing, electronics and information, environmental protection, energy-saving, bioengineering and medicine, all saw fast growth.

Zhongguancun Science Park has more than 590,000 research and development personnel. R&D investment grew nearly 18 percent year-on-year to reach 144 billion yuan during the period.

http://www.china.org.cn/business/2018-01/14/content_50224818.htm
 
China wants to make the chips that will add AI to any gadget
The AI boom offers Chinese chipmakers a chance to catch up after years of lagging behind.
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In an office at Tsinghua University in Beijing, a computer chip is crunching data from a nearby camera, looking for faces stored in a database. Seconds later, the same chip, called Thinker, is handling voice commands in Chinese. Thinker is designed to support neural networks. But what’s special is how little energy it uses—just eight AA batteries are enough to power it for a year.

Thinker can dynamically tailor its computing and memory requirements to meet the needs of the software being run. This is important since many real-world AI applications—recognizing objects in images or understanding human speech—require a combination of different kinds of neural networks with different numbers of layers.

In December 2017, a paper describing Thinker’s design was published in the IEEE Journal of Solid-State Circuits, a top journal in computer hardware design. For the Chinese research community, it was a crowning achievement.

The chip is just one example of an important trend sweeping China’s tech sector. The country’s semiconductor industry sees a unique opportunity to establish itself amid the current wave of enthusiasm for hardware optimized for AI. Computer chips are key to the success of AI, so China needs to develop its own hardware industry to become a real force in the technology (see “China’s AI Awakening”).

The West shouldn’t fear China’s artificial-intelligence revolution. It should copy it.
“Compared to how China responded to previous revolutions in information technology, the speed at which China is following the current [AI] trend is the fastest,” says Shouyi Yin, vice director of Tsinghua University’s Institute of Microelectronics and the lead author of the Thinker paper, referring to the effort to design neural-network processors in China.

Even as China has become a manufacturing hub of solar panels and smartphones, the country’s semiconductor industry lags far behind that of the U.S. Between January and September 2017, China spent $182.8 billion importing integrated circuits—a 13.5 percent increase from the previous year, according to the China Semiconductor Industry Association. Major U.S. tech companies, including Google and Intel, as well as a few startups, are developing chips for AI applications (see “The Race to Power AI’s Silicon Brains”).

In a three-year action plan to develop AI, published by China’s Ministry of Industry and Information Technology in December 2017, the government laid out a goal of being able to mass-produce neural-network processing chips by 2020.

thinker-chip-2.png


A schematic shows different elements of a chip called Thinker, developed at Tsinghua University in Beijing.
PROVIDED BY SHOUYI YIN, TSINGHUA UNIVERSITY INSTITUTE OF MICROELECTRONICS

While it is possible to run AI software using existing chips such as the powerful graphics chips or FPGAs (a kind of blank chip that can be reconfigured on the fly), those designs are expensive and do not lend themselves to small devices that use batteries. That’s why Yin’s team at Tsinghua developed Thinker.

Thinker could be embedded in a wide range of devices, such as smartphones, watches, home robots, or equipment stationed in remote areas. Yin’s team plans to launch the first product fitted with Thinker this March.

Similar projects are under way elsewhere in China. In late January, a research team at the Chinese Academy of Sciences’ Institute of Computing Technology (ICT) will have a local semiconductor manufacturer produce a small batch of chips for use in robots. The chip, called Dadu, has two cores—one for running neural networks and another for controlling motion. The neural core runs the algorithms for vision but also allows the motion core to plan the optimal route for reaching a destination or the best motion for grabbing an object.

Yinhe Han, director of the institute’s Cyber Computing Lab and head of the robot chip project, envisions a slew of applications, including robots that deliver coffee and drones controlled with hand gestures. The advantage of developing a system like this in China, he says, is the large user base, which makes updating chip design based on user experience faster.

China has tried, and failed, to shake up the chip industry before. In 2001 the ICT assembled a team to develop desktop CPUs. That team became the kernel of a Chinese chipmaker called Loongson, but the company’s products never became as widely used as the founders would have liked.

China’s integrated-circuit industry has expanded rapidly, accounting for 58 percent of the worldwide growth in the integrated-circuit market from 2000 to 2016. But in 2016, China’s share of worldwide semiconductor fabrication capacity was still only 14.2 percent, according to PwC. In a manufacturing policy announced by the central government in 2015, called Made in China 2025, chip design and fabrication was one of the key areas in which the government asked for a breakthrough.

However, Chinese chip startups find themselves in an environment that’s vastly different from the one that gave birth to Intel or Nvidia. Businesses have taken to cloud computing in droves, meaning there may be less of a market for off-the-shelf hardware, says Dongrui Fan, president of SmarCo, a Beijing-based startup that designs an AI chip for data centers that process video footage.

But China’s AI companies are increasingly also developing their own hardware.

“In the future, companies that only make chips may be fewer and fewer,” says Fengxiang Ma, director of ASIC design at Horizon Robotics, a Beijing-based startup focused on applying AI techniques in driving and cameras. In December 2017, Horizon released two computer vision chips. They can be used to enable vehicles to recognize pedestrians or help shopping malls find patterns in visitor traffic. Since its founding in 2015, the company has grown to more than 300 employees.

Ma says Horizon Robotics is not a chip company, but it designs the chips for its products in-house for better product performance and lower production cost.

For now, Chinese chip researchers have many problems to solve: how to commercialize their chip designs, how to scale up, and how to navigate a world of computing being transformed by AI. What’s not lacking, though, is ambition. “As chip researchers, we all have dreams,” says Yinhe Han of ICT. “We’ll see how far we can leap.”

https://www.technologyreview.com/s/...ake-the-chips-that-will-add-ai-to-any-gadget/
 
China launches cloud platform of integrated circuits, microsystems
Source: Xinhua| 2018-01-28 11:16:46|Editor: Mengjie


BEIJING, Jan. 28 (Xinhua) -- China's first online sharing platform for integrated circuits and microsystems has been launched by a state-owned enterprise.

The platform, initiated by China Electronics Technology Group Corporation (CETC), enables the public to have access to the CETC intellectual property database, software tools and production line.

The platform welcomes other enterprises to submit their research results online to promote development in the field.

China has called for improvements in its chip development as its electronic information industry has long-depended on imported chips.

"Developing the technology and industry of integrated circuits and microsystems not only goes with the tide of information technology development, but also meets the needs of integrated and intellectual development," said Xiong Qunli, CETC president.

Liu Liehong, general manager of the CETC, said the corporation was able to provide professional services for the industry of integrated circuits and microsystems with solid research basis.
 
SMIC obtains government fund for advanced node technology development

Staff reporter, DIGITIMES, Taipei

Thursday 1 February 2018
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has obtained financial support from the government to accelerate the development of its 14nm and more advanced process technologies.

SMIC announced recently China's National Semiconductor Industry Investment Fund (known as the Big Fund) and Shanghai Integrated Circuit Investment Fund (SICIF) have made capital investments in subsidiary Semiconductor Manufacturing South China (SMSC), which will become a joint venture between the parties. The stake in SMSC held collectively by SMIC Shanghai and SMIC Holdings has therefore reduced to 50.1% from 100%, SMIC added.

SMSC was founded at the end of 2016 with a capital base of only US$210 million, SMIC disclosed. With the Big Fund and SICIF becoming SMSC's new shareholders, SMSC is able to expand its registered capital to US$3.5 billion, with the Big Fund and SICIF holding 27.04% and 22.86%, respectively, of the JV company.

SMSC will help SMIC move forward in the development of advanced-node process technologies at a faster pace, according to SMIC. The JV company will be responsible for the development of SMIC's advanced 14nm and below process technologies, with a goal of fabricating 35,000 12-inch wafers monthly.

SMIC in 2015 formed a JV in Shanghai with Huawei, Qualcomm, and nano-electronics research institute Imec to focus on R&D of CMOS technology for the development of 14nm and beyond production processes. Dubbed SMIC Advanced Technology Research & Development (Shanghai), the JV company could assist SMSC in bringing 14nm and more advanced node technology into production, market observers believe.

In addition, SMIC's newly-appointed co-CEO Mong-song Liang, who worked previously for Samsung and was a senior director of R&D at TSMC's advanced modules technology division before joining Samsung, will play a key role in SMIC's advanced 14/10nm FinFET process technology R&D, according to the observers.

http://www.digitimes.com/news/a20180201PD209.html
 
:D:D

中科天芯发布国内首款光学相控阵技术固态激光雷达芯片A2

近日,中科天芯科技(北京)有限公司(以下简称“中科天芯”)联合中科院研究所开发并推出A2芯片,这是国内完全自主研发的第一款光学相控阵技术固态激光雷达芯片。

据了解,A2芯片是一款适用于短距离成像用的三维扫描固态相控阵芯片,是国内首次在硅基材料上制作的相控阵芯片。其原理是利用光波导阵列,通过相控调制方法实现激光的快速扫描。芯片使用完全与CMOS兼容的工艺完成,未来量产后成本非常低。

中科天芯公司相关负责人表示,该芯片可以广泛应用于5米内近距离的三维云图构建,扫描角度可达30度,角度分辨率可达0.01°,扫描速度可达1us左右,体积小,集成到三维构图设备内,可广泛应用于短距离激光雷达、人脸和手势识别、AR/VR、安防等领域。

据悉,中科天芯是中科院研究所在全固态激光扫描技术的产业转化应用平台,于2017年7月与中科院研究所共同成立联合实验室,依托中科院强大的技术和人才优势,以研究小组十余年在波导激光传感器研究的基础上,致力于将相关技术产业化,应用于激光雷达、激光显示等领域,立志成为本领域内世界先进的企业。

值得一提的是,与传统机械扫描技术相比,光学相控阵扫描技术的优势很是明显:

首先,扫描速度快。光学相控阵的扫描速度取决于所用材料的电学特性和器件结构,一般都可以达到MHz量级。

其次,扫描精度高或指向性好。光学相控阵的扫描精度取决于控制电信号的精度,可以做到mrad(千分之一度)量级。

再有,可控性好。光学相控阵的光束指向完全由电信号控制,在允许的角度范围内可以做到任意指向,可以在感兴趣的目标区域进行高密度的扫描,在其他区域进行稀疏扫描,这对于自动驾驶环境感知非常有用。

光学相控阵技术应用于固态激光雷达芯片,目前在国际范围内处于研发热点,中科天芯的A2芯片为国内第一个完全自主研发设计的产品,利用数百纳米的光波导阵列,通过相控调制方法实现激光的快速扫描,是国内固态激光雷达领域OPA技术方向的领先者。

除上述领域外,中科天芯还针对汽车驾驶、安防等领域,正在开发更远距离扫描的芯片。
 
Bitmain's rumored Ethereum ASIC miner could kill GPU mining
3-4 minutes
Bitmain rumored to be working on Ethereum ASIC miner, teased at 200-250MH/s for $2500-$3000

Right now we're in one of the worst positions ever for consumer graphics cards, with prices sky high and stocks at rock bottom, most GPUs are being eaten up by crypto miners. What can help, other than a purported next-gen GeForce GTX 20 series and possibly mining-specific SKUs of GTX 20 series cards? Ethereum ASIC miners, that's what.


The latest news coming in from China is that mining giant Bitmain is working on an Ethereum ASIC miner, the purported Antminer F3. Bitmain's rumored F3 Ethereum miner would pack 3 motherboards with 6 ASICs per motherboard, as well as 32 x 1GB DDR3 memory chips that would make for a very power efficient, but incredibly powerful Ethereum ASIC miner. This would put GPU mining for Ethereum out of business, almost overnight.

Bitmain is reportedly meeting with a few manufacturers in Taiwan, so you can be sure that they're talking to TSMC and others in order to see how many chips they can get their hands-on.

The new ETH ASIC chips will begin production later this month, with the ASICs hitting 200-200MH/s and this could be even better with final hardware. We would be looking at between $2500 and $3000 for the Atminer F3 Ethereum ASIC miner, which is not too bad at all considering the purported 200-220MH/s mining power.

Code:
https://www.tweaktown.com/news/60871/bitmains-rumored-ethereum-asic-miner-kill-gpu-mining/index.html

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cryptotimes.org
Bitmain Recorded $2.3 Billion Turnover Following Cryptocurrency Boom in 2017
Gemmali
3-4 minutes
Mark Twain rightly said, “During the gold rush it’s a good time to be in the pick and shovel business.” In the 21st century, Bitcoin is the new gold, and Application-specific Integrated Chips (ASICs) are the new picks, and business is booming for many submarkets in the space.

Swell of Market Demand
Unsurprisingly, Bitmain one of the largest mining hardware manufacturers announced massive profits associated with the firm’s ASIC chip sales. The China-based company accrued over $2 billion in sales in 2017 alone, with profit touching approximately $360 million. That makes Bitmain the most prominent business in the mining space.

This increase in profits can be correctly attributed to the rise in purchases of their highly popular ASIC S9 Miner. The product is a simple consumer-grade crypto miner, which is not only power efficient but also has the best return on investment for its users.

An apparent reason for the increase in mining is the boom in cryptocurrencies as well as the overall exposure the sector has received as of late. The explosive growth has bolstered the need for more mining chips and attracted manufacturers like TSMC who will focus more on the crypto scene rather than the smartphone chips market.

Mining in China
One challenge that Bitmain has faced since its inception is government regulation. Much of China’s mainland authorities have banned the usage of cryptocurrency and are now looking to close the application of crypto hardware. That could end up hurting sales for Bitmain’s mining chips. However, the pressure of shutdown has led Bitmain to seek more friendly overseas investment opportunities.

Furthermore, the massive consumption of electricity is also proving to be a hurdle for the hardware manufacturer. The energy consumption needed to mine cryptocurrency is skyrocketing, and this is another red flag for authorities. The bitcoin energy consumption index reveals a much similar characteristic.

Due to these two features, their operations are facing tightening efforts from the Chinese government. Principally, regulatory bodies will monitor more closely power usage and output by mining groups.

Despite this regulation attempts, they seem to be having little effect on chip companies like Bitmain. Nonetheless, this does not mean authorities can’t act on their words. For that reason, miners can face clamp down on their virtual currency and thus cash flow.

Source: BTC Manager

Code:
https://cryptotimes.org/cryptocurrency/bitmain-recorded-2-3-billion-turnover-following-cryptocurrency-boom-2017/
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eetimes.com
STMicro Licenses LDMOS From Chinese Chip Startup
2-3 minutes
power-management-designline-secondary.gif

News & Analysis

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LONDON — STMicroelectronics has licensed laterally diffused metal oxide semiconductor (LDMOS) RF power technology from Innogration Technologies, a Chinese semiconductor company specializing in the design and manufacturing of RF power semiconductor devices, modules, and sub-system assemblies.

Innogration is a start-up founded by Gordon Ma, who in the past worked with Freescale and Infineon and owns various patents on technology that ST wanted access to. Headquartered in Suzhou, China, Innogration claims to be the only commercial company doing vertical integration across multiple RF power semiconductor enablers, including core LDMOS and GaN in device and application areas with the addition of GaAs and VDMOS.

ST’s license gives it access to Innogration’s LDMOS technology and IP, enabling it to develop new products and expand the range of applications that ST can address on LDMOS. The companies’ R&D teams also expect to cooperate closely to allow both companies to co-develop relevant products for each specific segment of the RF power market.

LDMOS is a mature technology suited for applications such as wireless infrastructure, industrial, scientific, medical, avionics, radar and non-cellular radio. Combining a short conduction-channel length with a high breakdown voltage, LDMOS devices are typically used in RF power amplifiers —where they can be used in base stations for wireless communications systems — as well as in the power amplifiers for commercial and industrial systems.

— Nitin Dahad is a European correspondent for EE Times.
 
AMEC Introduces the Primo Nanova® System - Company's First ICP Etch Product for Chipmakers' most Advanced Memory and Logic Device Designs
NEWS PROVIDED BY
Advanced Micro-Fabrication Equipment Inc.
Mar 12, 2018, 11:00 ET

SHANGHAI, March 12, 2018 /PRNewswire/ -- This week at SEMICON China, Advanced Micro-Fabrication Equipment Inc. (AMEC) formally unveiled the Primo nanova® system (nanova) - the company's first inductively coupled plasma (ICP) etcher for high-volume front-end production of memory and logic ICs. The system combines proprietary ICP technology innovations and novel features to help customers achieve application imperatives like tight critical dimension (CD) uniformity and superior control. Key differentiations include a specialized symmetric chamber configuration that enables very high pumping speed, as well as a novel low-capacitive coupling coil design, and a temperature-controlled multiple-zone electrostatic chuck (ESC). With these and other unique features, the system delivers superior process performance for critical conductor and dielectric etch applications at device nodes of 5nm and below, at a cost of ownership (CoO) that is significantly lower than comparative tools.
AMEC_nanova.jpg

AMEC’s Primo nanova® ICP etch system
AMEC has received orders for the nanova system from multiple customers. Products have been shipped and the first tool is already in production and demonstrating very stable yield. The company is now accelerating demo requests. The system strengthens AMEC's portfolio of etch tools which includes multi-generation capacitively coupled plasma (CCP) dielectric and TSV etch product families.

The nanova system was engineered to address today's IC manufacturing complexities where new materials, new transistor structures, double and even quadruple patterning, and other technology advancements are helping to ensure continued device shrinks. Critical success imperatives for etch in this processing environment are high uniformity and superior control across the wafer, with wide process window. The nanova system meets these technical requirements in a cost-effective single-station chamber tool.

"The nanova system deploys today's most advanced etch technology to empower customers at the leading edge with enabling innovation and exceptional flexibility," said Dr. Tom Ni, VP and GM of AMEC's Etch Product Business Group. "The system can process diverse conductor etch applications, like STI, poly-gate, spacer, mask etching and etch-back, with industry-leading productivity and superior on-wafer performance. As an ICP-based technology, it can etch deep vertical holes, as well as shallow tapered features. It's a cost-competitive solution as well, thanks to a smaller-than-average footprint and an innovative design that reduces consumables use. We're excited to see customers already benefiting from the tool."

The Primo nanova System: Key Enabling Attributes and Advantages

The six-chamber tool with two load lock strippers features proprietary innovations that collectively enable higher productivity and greater throughput. They include:
  • A proprietary low-capacitive coupling coil design that enables more independent ion density and energy which is essential for higher selectivity and soft etch;
  • A symmetric chamber design featuring a multi-zone ESC and active-edge tilting control for better uniformity. AMEC engineered the design to overcome side-to-side non-uniformity which has been a persistent challenge in high-volume manufacturing;
  • Wide process window and precise localized profile control with significantly higher pumping speed when compared to similar products;
  • Innovative plasma-enhanced PVD coating, coupled with precise chamber wall temperature and superior chamber environment control for greater process stability and defect reduction.
Dr. Ni further noted: "Feedback from customers confirms that the nanova system delivers the on-wafer performance and productivity we intended, and with compelling CoO benefits. It's a flexible tool that is equipped to process diverse applications with minimal configuration adjustments."

Primo nanova is a trademark of Advanced Micro-Fabrication Equipment Inc.

Advanced Micro-Fabrication Equipment Inc. (AMEC)
AMEC is China's leading provider of advanced process technology to global manufacturers of semiconductors and solid-state lighting (SSL) products. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV Etch tools, helping chipmakers build devices at process nodes as low as 7nm. To date, nearly 800 AMEC process units have been positioned at 40 leading-edge semiconductor fabs across Asia. The company is also well established in Europe with AMEC MEMS tools running in production at major IDMs. In addition, with its MOCVD system, the company helps SSL manufacturers build today's most advanced LED products. To learn more about AMEC, please visit www.amec-inc.com.

SOURCE Advanced Micro-Fabrication Equipment Inc.

Related Links
http://www.amec-inc.com

https://www.prnewswire.com/news-rel...emory-and-logic-device-designs-300612248.html

This is the product (5nm etcher) the researchers were finalising in the video. Breaking the American and German duopoly in this technology.
 
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