dray
BANNED
- Joined
- Apr 8, 2013
- Messages
- 10,853
- Reaction score
- -1
- Country
- Location
You are quoting an article from February. I am quoting an article from last month.
You are quoting an article that itself says that the chip fab plans have been delayed, cancelled due to over capacity, and the focus has been shifted to chip design.
We are talking here only about fab, not design. Design is an altogether different story.
Some portions from your links:
"A spokesperson for Tower Semiconductor Ltd. (Migdal Haemek, Israel) confirmed JP's withdrawal in a email response to EE Times Europe.
"Indeed JP has withdrawn their part of out consortium. They had the role of investing money in this project. At this point, we are looking for other investors who may have interest in joining this deal," the spokesperson said. "
"Meanwhile the Hindustan Semiconductor Manufacturing Co. (HSMC), which is linked to STMicroelectronics and Silterra, Malaysia is still expected to move from 90nm down to 28nm and 20nm at a proposed location in Prantij, near Gandhinagar, Gujarat at cost of about 253 billion rupees (about $3.8 billion).
However, the HSMC project has received the boost of reported support from Lisu Su, CEO of Advanced Micro Devices Inc.. Local reports said that Su had met with Ravi Shankar Prasad, Indian telecom minister, and discussed matters linked to semiconductor policy and its HMSC fab proposal. According to the reports, AMD wants to help transform India into an electronics manufacturing hub".
"A third plan to foster a wafer fab in India comes from Cricket Semiconductor LLC, which wants to create an analog and power pure-play foundry near Indore in Madhya Pradesh. This plan came to light in 2015 but still requires details on funding, technology and customers".
The article I posted is suggesting to focus more on chip designing than manufacturing.