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Chip supplier says China will struggle to develop advanced technology

F-22Raptor

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The chief executive of JSR, one of the world’s largest suppliers of a material critical for semiconductor production, has said a lack of industry infrastructure will make it “very difficult” for China to develop cutting-edge chipmaking technology despite a push for self-sufficiency.

Eric Johnson, a rare American leader at a Japanese semiconductor company, also said in an interview that he expected chip sector supply bottlenecks to continue into 2023.

US export curbs on technologies required to make the most advanced chips have prompted China to invest heavily to develop its own semiconductor supply chain.

But Johnson said China would struggle to master the sophisticated chipmaking technology based on a technique known as extreme ultraviolet or EUV lithography.

“I think China also would love to develop their own EUV competency, their ecosystem for these things. I think it’s going to be very difficult for them to do that, frankly,” Johnson said.

Semiconductors, essential to products from smartphones to washing machines, have become a focus of competition between Washington and Beijing. Joe Biden on Friday began his first trip to Asia as US president by visiting a Samsung chip plant in South Korea and stressing his desire to secure semiconductor supply chains.

EUV lithography is a highly demanding process using light to etch minuscule integrated circuits on to silicon wafers.

Even if China “got a paper on exactly what the chemistries were . . . to manufacture that at the purities, and the precision and reproducibility is really tough”, Johnson said. “It’s not that simple and they don’t have the supply chain to support that, either.”

Tokyo-based JSR is a leading supplier of photoresists, thin layers of material used to transfer circuit patterns on to semiconductor wafers. Analysts said JSR has about 30-40 per cent of the global market for photoresists used to make advanced chips and counts Samsung, Taiwan’s TSMC and Intel of the US among its customers.

China is the world’s biggest importer of chips and has been investing heavily in semiconductor initiatives as part of its “Made in China 2025” push, which calls for 70 per cent self-sufficiency in the most important components for critical technologies by 2025.

But Johnson said “leading-edge capability takes decades and a lot of money to develop . . . you really need applications like the iPhone to pay for the stuff”.

Still, Johnson stressed that Beijing was aggressively investing in less advanced chipmaking technologies that were also important and that China was a big part of JSR’s growth strategy.


“It just takes time to bring new capacity online and that new capacity won’t really start to make an impact probably until the end of this year or next year.”

He said he expected it to be particularly “problematic” for the sector to meet demand for semiconductors for vehicles as they used less advanced chips which were less profitable and attracted less investment.

 
China has mass produced 12 nm chips, which is enough to meet 99% of commodity demand.

Because China lacks EUV lithography technology, it is temporarily unable to mass produce high-end chips of 7 nm and 5 nm levels.

But it's only a matter of time.
 
Of course China will struggle. All causes worth doing will have to overcome obstacles.
 
China has mass produced 12 nm chips, which is enough to meet 99% of commodity demand.

Because China lacks EUV lithography technology, it is temporarily unable to mass produce high-end chips of 7 nm and 5 nm levels.

But it's only a matter of time.

The problem for China is that the West continues to advance its semiconductor technology. IBM has already developed the first 2nm chip.

China is nowhere near catching the West in chip technology, and the West stranglehold on this tech is very strong.
 
The problem for China is that the West continues to advance its semiconductor technology. IBM has already developed the first 2nm chip.

China is nowhere near catching the West in chip technology, and the West stranglehold on this tech is very strong.
Huawei can use Stack Silicon Integration Technology.

Chinese telecoms giant Huawei pushes semiconductor packaging innovation to ease disruptions caused by US chip sanctions​

  • Huawei has filed a patent application on the mainland for ‘a type of chip stacking package and terminal device’
  • This innovation comes days after rotating chairman Guo Ping suggested that Huawei would use advanced chip packaging technology to help ease US restrictions
Che Pan
Published: 8:30pm, 7 Apr, 2022

Chinese telecommunications giant Huawei Technologies Co has filed a patent application on the mainland for a semiconductor packaging innovation, which industry analysts describe as a potential way to ease the disruptions caused by US chip sanctions on the firm’s operations.

The company’s patent application for “a type of chip stacking package and terminal device” is expected to help “solve the problem of high costs due to the use of through-chip via [also known as through-silicon via or TSV], while ensuring power supply requirements”, according to a statement released on Tuesday by the China National Intellectual Property Administration.

This innovation comes days after Huawei rotating chairman Guo Ping suggested at a press conference for the company’s annual report that it would use advanced chip packaging technology to help alleviate the firm’s struggles with US trade sanctions.

Privately-held Huawei, the world’s largest telecoms equipment maker and formerly China’s biggest smartphone vendor, was added to Washington’s trade blacklist in May 2019. The company has since scrambled to adapt its operations to tighter restrictions imposed in 2020, covering access to chips developed or produced using US technology, from anywhere.

Huawei did not immediately reply to a request for comment on Thursday.

TSV technology enables stacked chips to interconnect through direct contact, providing high-speed signal processing and improved photo detection for image sensing, according to a 2009 Institute of Electrical and Electronics Engineers paper. TSV was introduced into high-volume chip manufacturing during the past decade.
 
The problem for China is that the West continues to advance its semiconductor technology. IBM has already developed the first 2nm chip.

China is nowhere near catching the West in chip technology, and the West stranglehold on this tech is very strong.
Already developed as some lab toy ? or mass produced with profit ? huge difference.

China produced semi tech is where a huge chunk of the profit is, which funds further inroads into the top level while taking profit from west, gradually reducing them to gimmicky headlines like this 2nm.
 
The chief executive of JSR, one of the world’s largest suppliers of a material critical for semiconductor production, has said a lack of industry infrastructure will make it “very difficult” for China to develop cutting-edge chipmaking technology despite a push for self-sufficiency.

Eric Johnson, a rare American leader at a Japanese semiconductor company, also said in an interview that he expected chip sector supply bottlenecks to continue into 2023.

US export curbs on technologies required to make the most advanced chips have prompted China to invest heavily to develop its own semiconductor supply chain.

But Johnson said China would struggle to master the sophisticated chipmaking technology based on a technique known as extreme ultraviolet or EUV lithography.

“I think China also would love to develop their own EUV competency, their ecosystem for these things. I think it’s going to be very difficult for them to do that, frankly,” Johnson said.

Semiconductors, essential to products from smartphones to washing machines, have become a focus of competition between Washington and Beijing. Joe Biden on Friday began his first trip to Asia as US president by visiting a Samsung chip plant in South Korea and stressing his desire to secure semiconductor supply chains.

EUV lithography is a highly demanding process using light to etch minuscule integrated circuits on to silicon wafers.

Even if China “got a paper on exactly what the chemistries were . . . to manufacture that at the purities, and the precision and reproducibility is really tough”, Johnson said. “It’s not that simple and they don’t have the supply chain to support that, either.”

Tokyo-based JSR is a leading supplier of photoresists, thin layers of material used to transfer circuit patterns on to semiconductor wafers. Analysts said JSR has about 30-40 per cent of the global market for photoresists used to make advanced chips and counts Samsung, Taiwan’s TSMC and Intel of the US among its customers.

China is the world’s biggest importer of chips and has been investing heavily in semiconductor initiatives as part of its “Made in China 2025” push, which calls for 70 per cent self-sufficiency in the most important components for critical technologies by 2025.

But Johnson said “leading-edge capability takes decades and a lot of money to develop . . . you really need applications like the iPhone to pay for the stuff”.

Still, Johnson stressed that Beijing was aggressively investing in less advanced chipmaking technologies that were also important and that China was a big part of JSR’s growth strategy.


“It just takes time to bring new capacity online and that new capacity won’t really start to make an impact probably until the end of this year or next year.”

He said he expected it to be particularly “problematic” for the sector to meet demand for semiconductors for vehicles as they used less advanced chips which were less profitable and attracted less investment.

How many times China has proven the Americans wrong and you keep saying the same thing. Can't is not in China's vocabulary.
 
How many times China has proven the Americans wrong and you keep saying the same thing. Can't is not in China's vocabulary.
Mandarin has Can't and Cantonese starts with it.

Kidding aside, you're right. Chinese will find their way thru chip crisis eventually. I did a bit of amateur reading on what's involved and came to the conclusion it is impossible to duplicate the ASML design for the plant without ASML building it.


China however will likely be working on their design which will make the time frame. Ore like 7 to 10 years.


Question is can US leapfrog before then.
 
The problem for China is that the West continues to advance its semiconductor technology. IBM has already developed the first 2nm chip.

China is nowhere near catching the West in chip technology, and the West stranglehold on this tech is very strong.

Chinese learned to develop microprocessor from the British.


Now they can develop their own microprocessor and continue to advance at their own pace.

You lost the plot, son.
 
The problem for China is that the West continues to advance its semiconductor technology. IBM has already developed the first 2nm chip.

China is nowhere near catching the West in chip technology, and the West stranglehold on this tech is very strong.

the "west" have never stopped advancing, yet china has reached parity and even went ahead in some areas.
EUV is only a matter of time. its hard but not magic and physics works the same whether in china or the netherlands. china has the engineers and the funds. it wont be too long, just like everything else.
 
the "west" have never stopped advancing, yet china has reached parity and even went ahead in some areas.
EUV is only a matter of time. its hard but not magic and physics works the same whether in china or the netherlands. china has the engineers and the funds. it wont be too long, just like everything else.
China will never be able to replicate EUV , atleast using the principles ASML uses. That's not to say a completely different way can't be invented. The variable is how long it is going to take. If you think EUV plant is just some hyper scaled engg please ask one of (brilliant, not kidding) profs in Beijing Uni. They'll tell you what I said.
 
Heard of tunneling effect? The size for conventional semiconductor will stay at 1-2 nm due to this quantum principle. Time is on China’s side for sure.
 
Chinese learned to develop microprocessor from the British.


Now they can develop their own microprocessor and continue to advance at their own pace.

You lost the plot, son.

The US, Dutch, Taiwan, and SK have a chokehold on the entire semiconductor chain. Advancing at their current pace will leave them forever behind.
 
China has mass produced 12 nm chips, which is enough to meet 99% of commodity demand.

Because China lacks EUV lithography technology, it is temporarily unable to mass produce high-end chips of 7 nm and 5 nm levels.

But it's only a matter of time.

I respect your honesty on all posts. I agree China will be able to achieve wonders, they need another decade, and in many technologies China is already on par with the west.
 
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