SEMICONDUCTORS: Japan, U.S. to lay out road map for more chip cooperation

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Japan, U.S. to lay out road map for more chip cooperation​

Allies to issue statement on chip strategy at ministerial meeting in Detroit

TOKYO -- Japan and the U.S. are set to outline their plans for joint development of next-generation semiconductors, as the allies look to flesh out their bilateral cooperation in the strategic sector, Nikkei has learned.

The road map will be included in a joint statement that the two governments plan to issue at a ministerial meeting in Detroit, Michigan, on Friday. The plan is expected to call for speeding up joint development of technologies to ensure a stable supply of semiconductors, which are becoming increasingly important to economic security.

Yasutoshi Nishimura, Japan's minister of economy, trade and industry, and U.S. Secretary of Commerce Gina Raimondo will meet in Detroit on Friday. Their joint statement is expected to refer to bilateral cooperation on artificial intelligence, quantum computing and other cutting-edge technologies, in addition to computer chips.

Specifically, the two countries envision deepening cooperation between the Leading-edge Semiconductor Technology Center, set up by the Japanese Ministry of Economy, Trade and Industry in 2022, and the U.S. National Semiconductor Technology Center, and nurturing human resources in the semiconductor field and others.

Japanese Prime Minister Fumio Kishida and U.S. President Joe Biden agreed to develop concrete plans for technological cooperation before the just-ended Group of Seven summit in Hiroshima.

Rapidus, a new state-backed Japanese consortium founded to make homegrown next-generation chips, is teaming up with IBM of the U.S.

Japan, U.S. to lay out road map for more chip cooperation

Allies to issue statement on chip strategy at ministerial meeting in Detroit

asia.nikkei.com