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Foxconn, ARM Partner on New Chinese IoT Chip Design Center
http://global.bing.com/news/search?q=Foxconn&FORM=HDRSC6
October 20, 2016
Foxconn is aiming to expand its foothold in the semiconductor industry by partnering with SoftBank-owned ARM to create a new chip design center in Shenzhen, China.
The partnership highlights the ongoing efforts by the world’s largest contract electronics maker to build more key components and tap into new technologies for future growth faced with weakening global demand for smartphones.
Foxconn’s main focus would be on IoT-enabled chips; according to research company IC Insights, the IoT chip market will grow 19% to $18.4 billion in 2016, and will expand to $29.6 billion in 2019. Research group IDC estimates that the total IoT market will top $5 trillion in 2019.
“We want to get into semiconductor design and production,” Foxconn’s Terry Gou told China’s Shenzhen Satellite TV last week.
Foxconn’s attempt to build its own chips and its earlier acquisition of embattled Japanese electronics conglomerate Sharp in the hope of developing advanced organic light-emitting diode panel technology appear to be part of its strategy to better serve customers by supplying key components as well as providing assembly services.
Further, both chips and OLED panels offer better revenue and margins than Foxconn’s core assembly business. OLED panels are expected to be adopted by Apple’s premium iPhone handset next year.
Other than Apple, Foxconn also assembles handsets for major Chinese brands including Oppo, Huawei and Xiaomi, with Japan’s Sharp also planning to increase its smartphone offerings.
An industry executive said that Foxconn has been trying to develop an application-specific integrated circuit (ASIC), a customized chip, even though the company’s presence in the semiconductor field has been very limited so far. ASIC is designed for specific functions, such as a thermal sensor. It is not as powerful as a core processor or a graphic processor, but demand for ASIC is expected to surge with the rise of the IoT.
Shenzhen is already home to Foxconn’s China headquarters and now it seems that the coastal city may play an even more vital role in the Taiwanese manufacturing titan’s future, with Apple also expanding operations in the area.
http://global.bing.com/news/search?q=Foxconn&FORM=HDRSC6
October 20, 2016
Foxconn is aiming to expand its foothold in the semiconductor industry by partnering with SoftBank-owned ARM to create a new chip design center in Shenzhen, China.
The partnership highlights the ongoing efforts by the world’s largest contract electronics maker to build more key components and tap into new technologies for future growth faced with weakening global demand for smartphones.
Foxconn’s main focus would be on IoT-enabled chips; according to research company IC Insights, the IoT chip market will grow 19% to $18.4 billion in 2016, and will expand to $29.6 billion in 2019. Research group IDC estimates that the total IoT market will top $5 trillion in 2019.
“We want to get into semiconductor design and production,” Foxconn’s Terry Gou told China’s Shenzhen Satellite TV last week.
Foxconn’s attempt to build its own chips and its earlier acquisition of embattled Japanese electronics conglomerate Sharp in the hope of developing advanced organic light-emitting diode panel technology appear to be part of its strategy to better serve customers by supplying key components as well as providing assembly services.
Further, both chips and OLED panels offer better revenue and margins than Foxconn’s core assembly business. OLED panels are expected to be adopted by Apple’s premium iPhone handset next year.
Other than Apple, Foxconn also assembles handsets for major Chinese brands including Oppo, Huawei and Xiaomi, with Japan’s Sharp also planning to increase its smartphone offerings.
An industry executive said that Foxconn has been trying to develop an application-specific integrated circuit (ASIC), a customized chip, even though the company’s presence in the semiconductor field has been very limited so far. ASIC is designed for specific functions, such as a thermal sensor. It is not as powerful as a core processor or a graphic processor, but demand for ASIC is expected to surge with the rise of the IoT.
Shenzhen is already home to Foxconn’s China headquarters and now it seems that the coastal city may play an even more vital role in the Taiwanese manufacturing titan’s future, with Apple also expanding operations in the area.